P675R Thermostatic Bimetal strip
(Common Name: Truflex P675R, Chace 7500,Telcon200, Kanthal 1200)
Bimetallic TB208/110 holds very high thermal sensitivity and higher resistivity,but the modulus of elasticity and allowable stress is lower,it can improve the sensitivity of the instrument,decrease the size and increase the force.
Thermal bimetal strip is by the different expansion coefficient of two or more than two layers of metal or metal solid combination, and along the entire interface varies with temperature and the thermal function of shape changes in composite materials.One of high expansion coefficient become active layer, low expansion coefficient becomes passive.When requirements with high resistivity, but heat sensitive resistance performance is essentially the same type of thermal bimetal series, can be added between the two layers of different thickness of middle layer as a shunt layer, is to achieve the purpose of control different resistivity.
The basic characteristic of the thermal bimetal is changing with temperature and temperature deformation, resulting in a certain moment.Many devices use this feature to convert heat energy into mechanical work to achieve automatic control.Thermal bimetal used for control system and temperature sensor in the measuring instrument.
Composition
Grade | P675R |
High expansion layer | Mn75Ni15Cu10 |
Low expansion layer | Ni36 |
Chemical composition(%)
Grade | C | Si | Mn | P | S | Ni | Cr | Cu | Fe |
Ni36 | ≤0.05 | ≤0.3 | ≤0.6 | ≤0.02 | ≤0.02 | 35~37 | - | - | Bal. |
Grade | C | Si | Mn | P | S | Ni | Cr | Cu | Fe |
Mn75Ni15Cu10 | ≤0.05 | ≤0.5 | Bal. | ≤0.02 | ≤0.02 | 14~16 | - | 9~11 | ≤0.8 |
Typical Physical properties
Density (g/cm3) | 7.7 |
Electrical resistivity at 20ºC(ohm mm2/m) | 1.13 ±5% |
Thermal conductivity, λ/ W/(m*ºC) | 6 |
Elastic Modulus, E/ Gpa | 113~142 |
Bending K / 10-6 ºC-1(20~135ºC) | 20.8 |
Temperature bending rate F/(20~130ºC)10-6ºC-1 | 39.0%±5% |
Allowable temperature (ºC) | -70~ 200 |
Linear temperature (ºC) | -20~ 150 |