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Semi Automatic BGA Reballing Machine WDS 800 for PCB Positioning and Folding
Semi Automatic BGA Reballing Machine WDS 800 for PCB Positioning and Folding
Specifications
Brand Name :
WDS
Model Number :
WDS-800
Certification :
CE
Place of Origin :
China
MOQ :
1 UNIT
Payment Terms :
T/T, Western Union, MoneyGram
Supply Ability :
150 UNITS PER MONTH
Delivery Time :
8-15 working days
Packaging Details :
Wooden case
Heating :
3 Independent Heating Zones
PCB locating Way :
Outer or location hole
Placement precision :
±0.01mm
Weight :
140KG
Description

Make PCB positioning folding welding Full Automatic BGA Rework Sation WDS-800

Specification

Max PCB Size W650*D610mm
PCB Thickness 0.5-8mm
BGA Size 1*1-80*80mm
Min.ball pitch 0.15mm
Max Weight of BGA 150g
Placement precision ±0.01mm
PCB Locating Way Outer or location hole
Temperature Control K-type thermocouple,close loop control
Lower Heating Power Hot air 1200W
Upper Heating Power Hot air 1200W
Bottom pre-heating IR5000W
Power Supply (Double Phase)220V,50/60Hz
Machine Dimension L700*W1000*H950mm(without frame)
Machine Weight 140kg

Qutstanding performance features

  1. Multi-language menu interface
  2. Automatic feeding device
  3. X/Y axis can be controlled by joystick, easy and fast operation
  4. Imported high-definition CCD(2 million pixels) optical alignment system
  5. High precision temperature control system, accurate temperature control

HD optical alignment and interlligent control

The integrated design of hot air head and mounting head has the functions of automatic mounting, automatic welding and automatic disassembly. High precision K-type thermocouple(KSENSOR) Closed Loop control, up and down independent temperature measurement, temperature control accuracy up to ± 1 degree, Over-temperature protection alarm function, software encryption and anti-stay function.

The X/Y/Z axis is automatically shifted

The upper temperature zone is controlled by the joystick servosystem, X and Y are automatically controlled by the motor movement mode, so that the alignment is fast and convenient, and the speed can be controlled.

Vacuum adsrption and preheating platform

The upper heating head is equipped with a vacuum suction pipe for chip adsorption. The bottom preheating platform adopts imported excellent heating materials(infrared gold-plated light tube)+anti-flash thermostatic glass(temperature resistance up to 1800°C). The preheating area is up to 500*420mm. The preheating platform, splint device and cooling system can be moved as a whole in the X direction. Make PCB positioning and folding welding more safe and convenient.

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Semi Automatic BGA Reballing Machine WDS 800 for PCB Positioning and Folding

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Product Detail
Brand Name :
WDS
Model Number :
WDS-800
Certification :
CE
Place of Origin :
China
MOQ :
1 UNIT
Payment Terms :
T/T, Western Union, MoneyGram
Contact Supplier
Semi Automatic BGA Reballing Machine WDS 800 for PCB Positioning and Folding

Shenzhen Wisdomshow Technology Co.,ltd

Verified Supplier
1 Years
shenzhen
Since 2011
Business Type :
Manufacturer
Main Products :
Semi Automatic BGA Rework Station, Manual BGA Rework Station, Fully Automatic BGA Rework Station
Total Annual :
500000-1000000
Employee Number :
101~200
Certification Level :
Verified Supplier
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