MachineU > China Products > Chemicals > Inorganic Chemicals > Non-Metallic Products > Ceramics

Al2O3 Advanced Materials Ceramic Connector Blocks High Temperature 30 Kpsi-32 Kpsi

Specifications

Brand Name :

Antaeus

Model Number :

AD-C015

Certification :

Place of Origin :

Hunan,China

MOQ :

Negotiation

Price :

Negotiation

Payment Terms :

T/T or Negotiation

Supply Ability :

Full Supply

Delivery Time :

15-45 days

Packaging Details :

Inner vacuum packaging, outside carton.

Product Name :

Ceramic Connector Blocks / Special Functional Ceramics Parts

AL2O3 Content :

90% - 99%

Tensile :

30 Kpsi - 32 Kpsi

Flexural :

55 Kpsi - 60 Kpsi

Compressive :

300 Kpsi - 330 Kpsi

Density :

3.7 g/cc - 3.92 g/cc

Hardness :

13.8 HV, Gpa - 18 HV, Gpa

Thermal Conductivity :

25 W/(m K) - 32 W/(m K)

C.O.T.E :

75 In / In°C (x10^7) - 78 In / In°C (x10^7)

Working Temperature :

1500 °C - 1750 °C

Dielectric Constant :

9.5 - 9.8

Volume Resistivity :

>10^14 Ohm-cm

Dielectric Strength :

16 KV/mm - 20 KV/mm

Description

Ceramic Connector Blocks / Special Functional Ceramics Parts

1. Description:

Ceramic packages are made of 90–94 percent Al2O3, the rest of the formulation consisting of glass-forming alkaline-earth silicates. One major requirement is that the formulations be able to be cofired with tungsten or molybdenum metallization lines. The alumina layers are produced by tape casting/doctor blading, after which the tapes can be hole-punched or laser-cut, via-hole-coated (vias are conductive pathways between layers), and metallized with tungsten or molybdenum by screen printing. Several layers are then laminated into multilayer structures. Cofiring takes place at temperatures up to 1,600° C (2,900° F) in protective atmospheres of hydrogen or hydrogen-nitrogen gas in order to prevent the metals from oxidizing. The result of cofiring is a monolithic package with internal conductor paths. The silicon chip is mounted in the package, and the package is hermetically sealed with a glass or metal lid.

2. Feature Advantages:

1) High hardness and high density

2) Low thermal conductivity

3) Chemical inertness

4) Good wear resistance

5) High Fracture toughness

6) Good insulation performance

7) High temperature resistance

8) A variety of specifications is available

9) Satisfy various technical requests

10) Lower medium spoilage

11) Stiffness texture

12) Chemical inertness

13) Good wear resistance

14) High Fracture toughness

15) Good insulation performance

3. Material Features / Properties:

Composite	(wt %)	99%	99.5%	99.8%
Color		White or Ivory	White or Ivory	White or Ivory
Density	g/cm 3	3.82	3.9	3.92
Hardness	HRA	83	85	85
Flexural Strength	Mpa (psi*10 3 )	375	386	381

4. Technical Parameters:

Technical Parameters of Ceramics
Items	Test Conditions	Unit or Symbol	99% AL2O3	95% AL2O3	90% AL2O3	Zirconia	Steatite	Silicon Carbide
Volume Density	--	g/cm3	≥3.70	≥3.62	≥3.40	≥5.90	≥2.60	≥3.08
Tightness	--	Pa·m³/s	≤1.0×10-11	≤1.0×10-11	≤1.0×10-11	-	-	-
Liquid Permeability	--	--	Pass	Pass	Pass		Pass	-
Flexural Strength	-	MPa	≥300	≥280	≥230	≥1100	≥120	≥400
Elastic Modulus	-	GPa	-	≥280	≥250	≥220	-	400
Poisson Ratio	-	-	-	0.20～0.25	0.20～0.25	-	-	-
Thermal Shock Resistance	800℃( Room Temperature) Cycle: 10 times		Pass	Pass	Pass	-	-	-
Coefficient of Linear Expansion	20℃～100℃	×10-6 K-1	-	-	-		≤8	-
	20℃～500℃	×10-6 K-1	6.5～7.5	6.5～7.5	6.5～7.5	6.5～11.2	-	-
	20℃～800℃	×10-6 K-1	6.5～8.0	6.5～8.0	6.3～7.3		-	4
	20℃～1200℃	×10-6 K-1	-	7.0～8.5	-	-	-	-
Coefficient of Thermal Conductivity	20℃	W/(m·k)	-	-	-	-	-	90～110
Coefficient of Thermal Conductivity	1000℃	W/(m·k)	-	-	-	-	-	90～110
Dielectric Constant	1MHz 20℃	-	9.0～10.5	9.0～10	9.0～10	-	≤7.5	-
	1MHz 50℃	-	-	9.0～10	-	-	-	-
	10GHz 20℃	-	9.0～10.5	9.0～10	9.0～10	-	-	-
Volume Resistivity	100℃	Ω·cm	≥1.0×1013	≥1.0×1013	≥1.0×1013	-	≥1.0×1012	-
	300℃		≥1.0×1013	≥1.0×1010	≥1.0×1013	-	-	-
	500℃		≥1.0×109	≥1.0×108	--	-	-	-
Disruptive Strength	D.C	kV/mm	≥17	≥15	≥15	-	≥20	-
Chemical Durability	1:9HCl	mg/c㎡	≤0.7	≤7.0	-	-	-	-
Chemical Durability	10%NaOH	mg/c㎡	≤0.1	≤0.2	-	--	-	-
Grain Size	-	μm	-	3~12	-	-	-	-

5. Process Flows:

Formulating --- Granulating --- Forming --- Sintering --- Grinding --- Printing --- Nickel Plating --- Assembing --- Brazing --- Inspecting --- Packing