Ceramic Connector Blocks / Special Functional Ceramics Parts
1. Description:
Electronic circuit miniaturization is a steady trend in integrated circuit manufacturing. Hybrid microcircuits are a widely used approach to miniaturization of circuits. In a typical hybrid microcircuit, passive components are formed by thick or thin film technologies or mounted one by one as discrete components. A hybrid microcircuit can thus become large, with many components formed or mounted on the substrate. With the increasing demand for electronic equipment with reduced size and higher integration density, circuit devices and components must have compact design and high reliability.
1) High hardness and high density
2) Low thermal conductivity
3) Chemical inertness
4) Good wear resistance
5) High Fracture toughness
6) Good insulation performance
7) High temperature resistance
8) A variety of specifications is available
9) Satisfy various technical requests
10) Lower medium spoilage
11) Stiffness texture
12) Chemical inertness
13) Good wear resistance
14) High Fracture toughness
15) Good insulation performance
3. Material Features / Properties:
Color | White or Ivory | White or Ivory | White or Ivory | |
Density | g/cm 3 | 3.82 | 3.9 | 3.92 |
Hardness | HRA | 83 | 85 | 85 |
Flexural Strength | Mpa (psi*10 3 ) | 375 | 386 | 381 |
4. Technical Parameters:
Technical Parameters of Ceramics | ||||||||
Items | Test Conditions | Unit or Symbol | 99% AL2O3 | 95% AL2O3 | 90% AL2O3 | Zirconia | Steatite | Silicon Carbide |
Volume Density | -- | g/cm3 | ≥3.70 | ≥3.62 | ≥3.40 | ≥5.90 | ≥2.60 | ≥3.08 |
Tightness | -- | Pa·m³/s | ≤1.0×10-11 | ≤1.0×10-11 | ≤1.0×10-11 | - | - | - |
Liquid Permeability | -- | -- | Pass | Pass | Pass | Pass | - | |
Flexural Strength | - | MPa | ≥300 | ≥280 | ≥230 | ≥1100 | ≥120 | ≥400 |
Elastic Modulus | - | GPa | - | ≥280 | ≥250 | ≥220 | - | 400 |
Poisson Ratio | - | - | - | 0.20~0.25 | 0.20~0.25 | - | - | - |
Thermal Shock Resistance | 800℃( Room Temperature) Cycle: 10 times | Pass | Pass | Pass | - | - | - | |
Coefficient of Linear Expansion | 20℃~100℃ | ×10-6 K-1 | - | - | - | ≤8 | - | |
20℃~500℃ | ×10-6 K-1 | 6.5~7.5 | 6.5~7.5 | 6.5~7.5 | 6.5~11.2 | - | - | |
20℃~800℃ | ×10-6 K-1 | 6.5~8.0 | 6.5~8.0 | 6.3~7.3 | - | 4 | ||
20℃~1200℃ | ×10-6 K-1 | - | 7.0~8.5 | - | - | - | - | |
Coefficient of Thermal Conductivity | 20℃ | W/(m·k) | - | - | - | - | - | 90~110 |
1000℃ | ||||||||
Dielectric Constant | 1MHz 20℃ | - | 9.0~10.5 | 9.0~10 | 9.0~10 | - | ≤7.5 | - |
1MHz 50℃ | - | - | 9.0~10 | - | - | - | - | |
10GHz 20℃ | - | 9.0~10.5 | 9.0~10 | 9.0~10 | - | - | - | |
Volume Resistivity | 100℃ | Ω·cm | ≥1.0×1013 | ≥1.0×1013 | ≥1.0×1013 | - | ≥1.0×1012 | - |
300℃ | ≥1.0×1013 | ≥1.0×1010 | ≥1.0×1013 | - | - | - | ||
500℃ | ≥1.0×109 | ≥1.0×108 | -- | - | - | - | ||
Disruptive Strength | D.C | kV/mm | ≥17 | ≥15 | ≥15 | - | ≥20 | - |
Chemical Durability | 1:9HCl | mg/c㎡ | ≤0.7 | ≤7.0 | - | - | - | - |
10%NaOH | mg/c㎡ | ≤0.1 | ≤0.2 | - | -- | - | - | |
Grain Size | - | μm | - | 3~12 | - | - | - | - |
5. Process Flows:
Formulating --- Granulating --- Forming --- Sintering --- Grinding --- Printing --- Nickel Plating --- Assembing --- Brazing --- Inspecting --- Packing
6. Application Fields:
Widely apply for new energy vehicles, charging piles, solar power generation, energy storage and power storage system, electric vehicle power system and so on.
7. Production Facilities: Prilling Tower , Forming Machine , High Temperature Sintering Kiln
8. Detection Devices:
Electric Performance Tester , Film Thickness Analyzer , Granulometer , Helium Mass Spectrometer Leak Detector , Universal Pull Force Meter
9.Order Flow Steps as belows: Inquiry ---Quotation --- Place an order --- Production --- Delivery
10. Our advantages: Quality Assurance ; Price Competitive ; Factory Supply Directly ; Good Service
11.Shipping and Package:
12. Our aimed market :
Notes:Above information only for reference and please contact with us for more details freely when you have any inquiry!