MachineU > China Products > Chemicals > Inorganic Chemicals > Non-Metallic Products > Ceramics

Specifications

Brand Name :

Antaeus

Model Number :

AD-D011

Certification :

Place of Origin :

Hunan,China

MOQ :

Negotiation

Price :

Negotiation

Payment Terms :

T/T or Negotiation

Supply Ability :

Full Supply

Delivery Time :

15-45 days

Packaging Details :

Inner vacuum packaging, outside carton.

Product Name :

Electronic Ceramic Components / Electronic Ceramics

AL2O3 Content :

90% - 99%

Tensile :

30 Kpsi - 32 Kpsi

Flexural :

55 Kpsi - 60 Kpsi

Compressive :

300 Kpsi - 330 Kpsi

Density :

3.7 g/cc - 3.92 g/cc

Hardness :

13.8 HV, Gpa - 18 HV, Gpa

Thermal Conductivity :

25 W/(m K) - 32 W/(m K)

C.O.T.E :

75 In / In°C (x10^7) - 78 In / In°C (x10^7)

Working Temperature :

1500 °C - 1750 °C

Dielectric Constant :

9.5 - 9.8

Volume Resistivity :

>10^14 Ohm-cm

Dielectric Strength :

16 KV/mm - 20 KV/mm

Description

Electronic Ceramic Components / Ceramic Electronic Parts

1. Description:

Market research conducted in 1998 by the Japan Technology Transfer Association clarified that the actual demands for actuators are: 100 μm displacement, 100 N force and 100 μs response. Because neither the multilayer nor the bimorph can satisfy this actual demand, composite actuator structures called the ‘moonie’ and ‘cymbal’ were developed to provide characteristics intermediate between the multilayer and bimorph actuators; this type of transducer has a displacement an order of magnitude larger than the multilayer, and a much larger generative force with a quicker response than the bimorph.73 The device consists of a thin multilayer piezoelectric element and two metal plates with a narrow moon-shaped or cymbal-shaped cavity bonded together as shown in Fig. 3.27. The moonie, with a size of 5 × 5 × 2.5 mm3, can generate a 20 μm displacement under 60 V, eight times as large as the generative displacement produced by a multilayer of the same size.74 This new compact actuator has been used in a miniaturized laser beam scanner.

2. Feature Advantages:

1) High hardness and high density

2) Low thermal conductivity

3) Chemical inertness

4) Good wear resistance

5) High Fracture toughness

6) Good insulation performance

7) High temperature resistance

8) A variety of specifications is available

9) Satisfy various technical requests

10) Lower medium spoilage

11) Stiffness texture

12) Chemical inertness

13) Good wear resistance

14) High Fracture toughness

15) Good insulation performance

3. Material Features / Properties:

Composite	(wt %)	99%	99.5%	99.8%
Color		White or Ivory	White or Ivory	White or Ivory
Density	g/cm 3	3.82	3.9	3.92
Hardness	HRA	83	85	85
Flexural Strength	Mpa (psi*10 3 )	375	386	381

4. Technical Parameters:

Technical Parameters of Ceramics
Items	Test Conditions	Unit or Symbol	99% AL2O3	95% AL2O3	90% AL2O3	Zirconia	Steatite	Silicon Carbide
Volume Density	--	g/cm3	≥3.70	≥3.62	≥3.40	≥5.90	≥2.60	≥3.08
Tightness	--	Pa·m³/s	≤1.0×10-11	≤1.0×10-11	≤1.0×10-11	-	-	-
Liquid Permeability	--	--	Pass	Pass	Pass		Pass	-
Flexural Strength	-	MPa	≥300	≥280	≥230	≥1100	≥120	≥400
Elastic Modulus	-	GPa	-	≥280	≥250	≥220	-	400
Poisson Ratio	-	-	-	0.20～0.25	0.20～0.25	-	-	-
Thermal Shock Resistance	800℃( Room Temperature) Cycle: 10 times		Pass	Pass	Pass	-	-	-
Coefficient of Linear Expansion	20℃～100℃	×10-6 K-1	-	-	-		≤8	-
	20℃～500℃	×10-6 K-1	6.5～7.5	6.5～7.5	6.5～7.5	6.5～11.2	-	-
	20℃～800℃	×10-6 K-1	6.5～8.0	6.5～8.0	6.3～7.3		-	4
	20℃～1200℃	×10-6 K-1	-	7.0～8.5	-	-	-	-
Coefficient of Thermal Conductivity	20℃	W/(m·k)	-	-	-	-	-	90～110
Coefficient of Thermal Conductivity	1000℃	W/(m·k)	-	-	-	-	-	90～110
Dielectric Constant	1MHz 20℃	-	9.0～10.5	9.0～10	9.0～10	-	≤7.5	-
	1MHz 50℃	-	-	9.0～10	-	-	-	-
	10GHz 20℃	-	9.0～10.5	9.0～10	9.0～10	-	-	-
Volume Resistivity	100℃	Ω·cm	≥1.0×1013	≥1.0×1013	≥1.0×1013	-	≥1.0×1012	-
	300℃		≥1.0×1013	≥1.0×1010	≥1.0×1013	-	-	-
	500℃		≥1.0×109	≥1.0×108	--	-	-	-
Disruptive Strength	D.C	kV/mm	≥17	≥15	≥15	-	≥20	-
Chemical Durability	1:9HCl	mg/c㎡	≤0.7	≤7.0	-	-	-	-
Chemical Durability	10%NaOH	mg/c㎡	≤0.1	≤0.2	-	--	-	-
Grain Size	-	μm	-	3~12	-	-	-	-

5. Process Flows:

Formulating --- Granulating --- Forming --- Sintering --- Grinding --- Printing --- Nickel Plating --- Assembing --- Brazing --- Inspecting --- Packing