High Voltage Bootstrap High Side Driver

The ISL6801 is a single monolithic, inverting bootstrap driver. Its floating Level Shifter Section is optimized for the control of N-Channel Power MOSFETs in high side configurations with Bus Voltages up to 120VDC from a 5V Controller Output. It features two output stages pinned out separately to allow independent control of rise and fall times. To ensure static DC operation an integrated recharge path charges the bootstrap cap while the driver is switched off. A pull-up resistor forces the input low when no control signal is applied. The supply voltage is monitored to guarantee faultless operation at start-up.

Features

• Single Bootstrap High Side Driver

• Bootstrap Supply Max Voltage. . . . . . . . . . . . . . . 120VDC

• Peak Output Drive Current. . . . . . . . . . . . . . . . . . . 200mA

• Switching Frequency . . . . . . . . . . . . . . . . . . . . . . . 100kHz

• Active Low Input

• Separate Reset Input

• Recharge Path for Static Operation

• Separate High and Low Gate Drive Outputs Allow Independent Turn ON/OFF Time Control

• Supply Undervoltage Protection

• Space Saving SO-8 Package

• Wide Operating Temperature Range

Applications

• Driver for N-Channel MOSFETs in High Side Configurations that Control Ground Referenced Loads

• Drives Solenoids, Motors, Relays and Lamps in Automotive Applications

Pinout

Absolute Maximum Ratings

Supply Voltage, V_CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16V

Driver Output Stage Voltage, V_B (Referred to GND) . . . . . . . . .130V

Source Reference Voltage, V_S

(-5V for 0.5ms, MOSFET Off). . . . . . . . . . . . . . . . . . . . (Min) -1.5V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (Max) 120V

ESD Rating, V_ESD

Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . (Min) 820V

(Per MIL-STD-883 Method 3015.7)

Operating Conditions

Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . -40℃ to 125℃

Supply Voltage Range (Max). . . . . . . . . . . . . . . . . . . . 4.5V to 6.5V

Thermal Information

Thermal Resistance (Typical, Note 1) θ_JA (℃/W)

SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

Maximum Junction Temperature (Plastic Package) . . . . . . . . 150℃

Maximum Storage Temperature Range . . . . . . . . . . -55℃ to 150℃

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 245℃

(SOIC Lead Tips Only)

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE: 1. θ_JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

Typical Application Block Diagram

Functional Block Diagram

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