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AGN200A12Z Electronic IC Chip ULTRA-SMALL PACKAGE SLIM POLARIZED RELAY
AGN200A12Z Electronic IC Chip ULTRA-SMALL PACKAGE SLIM POLARIZED RELAY
Specifications
Brand Name :
Anterwell
Model Number :
AGN200A12Z
Certification :
new & original
Place of Origin :
original factory
MOQ :
10pcs
Price :
Negotiate
Payment Terms :
T/T, Western Union, Paypal
Supply Ability :
7900pcs
Delivery Time :
1 day
Packaging Details :
Please contact me for details
Initial contact resistance, max. :
100 mΩ
Initial insulation resistance :
Min. 1,000MΩ (at 500V DC)
Temperature rise (at 20°C) :
Max. 50°C
Unit weight :
Approx. 1 g
Description

Stock Offer (Hot Sell)

Part No. Quantity Brand D/C Package
EL817B-F 12000 EL 16+ DIP
EL817C-F 12000 EVERLIGHT 16+ DIP
EL817S(A)(TA)-F 68000 EVERLIGHT 12+ SOP-4
EM639165TS-6G 7930 ETRONTECH 15+ TSOP-54
EM63A165TS-6G 13467 ETRONTECH 14+ TSOP-54
EM78P459AKJ-G 9386 EMC 15+ DIP-24
EMI2121MTTAG 5294 ON 15+ DFN
ENC28J60-I/SO 7461 MICROCHIP 16+ SOP-28
EP1C3T144C8N 3452 ALTERA 13+ QFP144
EP3C5F256C8N 2848 ALTERA 15+ BGA
EP3C80F780I7N 283 ALTERA 16+ BGA
EP9132 3575 EXPLORE 16+ TQFP-80
EPC1213LC-20 3527 ALT 03+ PLCC20
EPC1213PC8 8853 ALTERA 95+ DIP-8
EPC2LI20N 2794 ALTERA 13+ PLCC
EPM7032SLC44-10N 2472 ALTERA 13+ PLCC44
EPM7064SLC44-10N 2498 ATLERA 15+ PLCC
EPM7128SQC100-10N 1714 ALTERA 12+ QFP
ERA-1SM+ 3210 MINI 15+ SOT-86
ES1B-E3/61T 18000 VISHAY 14+ DO-214AC
ES2G-E3/52T 12000 VISHAY 16+ SMB
ES2J-E3/52T 12000 VISHAY 13+ DO-214AA
ES3J 12000 FSC 15+ SMC
ES56031S 3498 ES 16+ SOP-24
ESAD92-02 6268 FUIJ 16+ TO-3P
ESD112-B1-02EL E6327 23000 15+ TSLP-2-20
ESD5Z5.0T1G 9000 ON 13+ SOD-523
ESD5Z7.0T1G 12000 ON 16+ SOD-523
ESDA6V1SC5 51000 ST 15+ SOT23-5
ESP-12E 3991 AI 16+ SMT

ULTRA-SMALL PACKAGE SLIM POLARIZED RELAY

FEATURES

• Compact slim body saves space

Thanks to the small surface area of 5.7 mm × 10.6 mm .224 inch × .417 inch and low height of 9.0 mm .354 inch, the packaging density can be increased to allow for much smaller designs.

• Outstanding surge resistance.

Surge withstand between open contacts: 1,500 V 10×160 µs (FCC part 68) Surge withstand between contacts and coil: 2,500 V 2×10 µs (Bellcore)

• The use of twin crossbar contacts ensures high contact reliability.

AgPd contact is used because of its good sulfide resistance. Adopting low-gas molding material. Coil assembly molding technology which avoids generating volatile gas from coil.

• Increased packaging density

Due to highly efficient magnetic circuit design, leakage flux is reduced and changes in electrical characteristics from components being mounted close-together are minimized. This all means a packaging density higher than ever before.

• Nominal operating power: 140 mW

• Outstanding vibration and shock resistance.

Functional shock resistance: 750 m/s2 {75G}

Destructive shock resistance: 1,000 m/s2 {100G}

Functional vibration resistance: 10 to 55 Hz (at double amplitude of 3.3 mm .130 inch)

Destructive vibration resistance: 10 to 55 Hz (at double amplitude of 5 mm .197 inch)

AGN200A12Z Electronic IC Chip ULTRA-SMALL PACKAGE SLIM POLARIZED RELAY

TYPICAL APPLICATIONS

• Telephone exchange, transmission equipment

• Communications devices

• Measurement devices

• Home appliances, and audio/visual equipment

• Handheld and portable products

Product tags

omron miniature relay

,

semiconductor relay

,

opto 22 solid state relay
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AGN200A12Z Electronic IC Chip ULTRA-SMALL PACKAGE SLIM POLARIZED RELAY

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Product Detail
Brand Name :
Anterwell
Model Number :
AGN200A12Z
Certification :
new & original
Place of Origin :
original factory
MOQ :
10pcs
Price :
Negotiate
Contact Supplier
AGN200A12Z Electronic IC Chip ULTRA-SMALL PACKAGE SLIM POLARIZED RELAY

Anterwell Technology Ltd.

Site Member
9 Years
guangdong, shenzhen
Since 2004
Business Type :
Distributor/Wholesaler, Trading Company
Main Products :
Integrated Circuit Chip, Programmable IC Chips, Circuit Board Chips
Total Annual :
500000-1000000
Employee Number :
20~30
Certification Level :
Site Member
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