Specifications
Brand Name :
Bicheng Enterprise Limited
Model Number :
BIC-0044-V1.0
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD40~50 Per Piece
Payment Terms :
T/T, Paypal
Supply Ability :
45000 pieces per month
Delivery Time :
5-6 working days
Packaging Details :
Vacuum
Board Material :
RO3035
Board Thickness :
1.6mm +/-0.1
Surface Cu thickness :
35 um (1 oz)
Inner Iayer Cu thicknes :
35 um (1 oz)
Surface Finish :
Immersion Gold
Solder Mask Colour :
Green
Color of Silkscreen :
White
Function :
100% Pass electrical test
Description

Rogers RO3035 RF Printed Circuit Board 2-Layer Rogers 3035 60mil 1.524mm Microwave PCB with Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RO3035 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3035 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.

Typical applications:

1) Automotive radar

2) Cellular telecommunications systems

3) Datalink on cable systems

4) Direct broadcast satellites

5) Global positioning satellite antennas

6) Patch antenna for wireless communications

7) Power amplifiers and antennas

8) Power backplanes

9) Remote meter readers

Rogers RO3035 RF Printed Circuit Board 2-Layer Rogers 3035 60mil 1.524mm Microwave PCB with Immersion Gold

PCB Specifications

PCB SIZE 100 x 100mm=6PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3035 1.524mm
copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 14 mil / 14 mil
Minimum / Maximum Holes: 0.4 mm / 4.0 mm
Number of Different Holes: 1
Number of Drill Holes: 1
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: RO3035 1.524mm
Final foil external: 1 oz
Final foil internal: N/A
Final height of PCB: 1.6 mm ±0.16mm
PLATING AND COATING
Surface Finish Immersion Gold
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Data Sheet of Rogers 3035 (RO3035)

RO3035 Typical Value
Property RO3035 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z 10 GHz/23 IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0015 Z 10 GHz/23 IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -45 Z ppm/ 10 GHz -50to 150 IPC-TM-650 2.5.5.5
Dimensional Stability 0.11
0.11
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107 COND A IPC 2.5.17.1
Tensile Modulus 1025
1006
X
Y
MPa 23 ASTM D 638
Moisture Absorption 0.04 % D48/50 IPC-TM-650 2.6.2.1
Specific Heat j/g/k Calculated
Thermal Conductivity 0.5 W/M/K 50 ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288
)
17
17
24
X
Y
Z
ppm/ 23/50% RH IPC-TM-650 2.4.4.1
Td 500 TGA ASTM D 3850
Density 2.1 gm/cm3 23 ASTM D 792
Copper Peel Stength 10.2 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes

Rogers RO3035 RF Printed Circuit Board 2-Layer Rogers 3035 60mil 1.524mm Microwave PCB with Immersion Gold

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Rogers RO3035 RF Printed Circuit Board 2-Layer Rogers 3035 60mil 1.524mm Microwave PCB with Immersion Gold

Ask Latest Price
Brand Name :
Bicheng Enterprise Limited
Model Number :
BIC-0044-V1.0
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD40~50 Per Piece
Contact Supplier
Rogers RO3035 RF Printed Circuit Board 2-Layer Rogers 3035 60mil 1.524mm Microwave PCB with Immersion Gold
Rogers RO3035 RF Printed Circuit Board 2-Layer Rogers 3035 60mil 1.524mm Microwave PCB with Immersion Gold
Rogers RO3035 RF Printed Circuit Board 2-Layer Rogers 3035 60mil 1.524mm Microwave PCB with Immersion Gold

Shenzhen Bicheng Electronics Technology Co., Ltd

Site Member
9 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Site Member
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