Specifications
Brand Name :
Bicheng Technologies Limited
Model Number :
BIC-135-V0.22
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD 2.99-8.99 PER PIECE
Payment Terms :
T/T, Western Union
Supply Ability :
45000 pieces per month
Delivery Time :
10 working days
Packaging Details :
Vacuum
Number of Layers :
2
Glass Epoxy: :
RO4350B 20.7mil (0.526mm), Tg 288℃
Final foil :
1.0 Oz
Final height of PCB: :
0.6 mm ±10%
Surface Finish :
Electroless nickel over Immersion Gold (ENIG)( 1 µ" over 100 µ" nickel)
Solder Mask Color: :
Green
Colour of Component Legend :
White
Test :
100% Electrical Test prior shipment
Description

RO4350B Low Profile (LoPro) RF Circuit Board 20.7mil Rogers High Frequency PCB With Ni/Au for Low Noise Amplifier

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

RO4350B LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4350B dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4350B laminate system.

RO4350B Low Profile (LoPro) RF Circuit Board 20.7mil Rogers High Frequency PCB With Ni/Au for Low Noise Amplifier

Features and Benefits:

RO4350B materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

1. Lower insertion loss

2. Low PIM

3. Increased signal integrity

4. High circuit density

Low Z-axis coefficient of thermal expansion

1. Multi-layer board capability

2. Design flexibility

Lead-free process compatible

1. High temperature processing

2. Meets environmental concerns

CAF resistant

Our PCB Capability (RO4350B LoPro)

PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4350B LoPro
Dielectric constant: 3.48±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10.7mil (0.272mm), 14mil (0.356mm), 17.3mil (0.439mm), 20.7mil(0.526mm), 30.7mil (0.780mm), 60.7mil(1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..

Some Typical Applications:

1. Digital applications such as servers, routers, and high speed back planes

2. Cellular base station antennas and power amplifiers

3. LNB’s for direct broadcast satellites

4. RF Identification Tags

Typical Properties of RO4350B LoPro

Property Typical Value Direction Units Condition Test Method
Dielectric Constant, Process 3.48 ± 0.05 z -- 10 GHz/23°C IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, Design 3.55 z -- 8 to 40 GHz Differential Phase Length Method
Dissipation Factor tan, 0.0037 0.0031 z -- 10 GHz/23°C 2.5 GHz/23°C IPC-TM-650 2.5.5.5
Thermal Coeffifi cient of r 50 z ppm/°C -50°C to 150°C IPC-TM-650 2.5.5.5
Volume Resistivity 1.2 X 1010 MΩ•cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 5.7 X 109 COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) z KV/mm(V/mil) 0.51mm(0.020”) IPC-TM-650 2.5.6.2
Tensile Modulus 11473(1664) Y MPa(kpsi) RT ASTM D638
Tensile Strength 175(25.4) Y MPa(kpsi) RT ASTM D638
Flexural Strength 255(37) MPa(kpsi) IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m(mils/inch) after etch +E2/150°C IPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion 14 x ppm/°C -55 to 288°C IPC-TM-650 2.1.41
16 y
35 z
Tg >280 °C TMA A IPC-TM-650 2.4.24.3
Td 390 °C TGA ASTM D3850
Thermal Conductivity 0.62 W/m/°K 80°C ASTM C518
Moisture Absorption 0.06 % 48 hrs immersion 0.060” sample Temperature 50°C ASTM D570
Density 1.86 gm/cm3 23°C ASTM D792
Copper Peel Strength 0.88(5.0) N/mm(pli) after solder float 1 oz. TC Foil IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-Free Process Compatible Yes

RO4350B Low Profile (LoPro) RF Circuit Board 20.7mil Rogers High Frequency PCB With Ni/Au for Low Noise Amplifier
RO4350B Low Profile (LoPro) RF Circuit Board 20.7mil Rogers High Frequency PCB With Ni/Au for Low Noise Amplifier
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RO4350B Low Profile (LoPro) RF Circuit Board 20.7mil Rogers High Frequency PCB With Ni/Au for Low Noise Amplifier

Ask Latest Price
Brand Name :
Bicheng Technologies Limited
Model Number :
BIC-135-V0.22
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD 2.99-8.99 PER PIECE
Contact Supplier
RO4350B Low Profile (LoPro) RF Circuit Board 20.7mil Rogers High Frequency PCB With Ni/Au for Low Noise Amplifier
RO4350B Low Profile (LoPro) RF Circuit Board 20.7mil Rogers High Frequency PCB With Ni/Au for Low Noise Amplifier
RO4350B Low Profile (LoPro) RF Circuit Board 20.7mil Rogers High Frequency PCB With Ni/Au for Low Noise Amplifier
RO4350B Low Profile (LoPro) RF Circuit Board 20.7mil Rogers High Frequency PCB With Ni/Au for Low Noise Amplifier

Shenzhen Bicheng Electronics Technology Co., Ltd

Site Member
9 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Site Member
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