Specifications
Brand Name :
Bicheng Technologies Limited
Model Number :
BIC-105-V6
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD 9.99-99.99
Payment Terms :
T/T, Paypal
Supply Ability :
50000 pieces per month
Delivery Time :
10 working days
Packaging Details :
Vacuum
Glass Epoxy :
TMM4
Final height of PCB :
1.6 mm ±0.1mm
Final foil external: :
1oz
Surface Finish :
ENIG
Solder Mask Color: :
NO
Colour of Component Legend :
NO
Number of Layers :
2 layers
Description

TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

General Description

This is a type of double layer RF PCB which is made on Rogers TMM4 60mil substrate. There’s only 1 NPTH hole in the board with 0.5oz base copper plated to 1oz. The surface finish on pads is immersion gold and no solder mask or silkscreen printed. Track layer is on top and whole bottom layer is copper covered as shielding function. The boards are fabricated as per IPC Class II standard and 100% electrical tested before shipment. Every 25 board are vacuum packed for delivery.

PCB Specifications

PCB SIZE 90 x 90mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 17um(0.5 oz)+plate TOP layer
TMM4 1.524mm
copper ------- 17um(0.5 oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 100 mil / 100 mil
Minimum / Maximum Holes: 1.5 mm / 1.5 mm
Number of Different Holes: 1
Number of Drill Holes: 1
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: TMM4 1.524mm
Final foil external: 1.0 oz
Final foil internal: N/A
Final height of PCB: 1.6 mm ±0.16
PLATING AND COATING
Surface Finish Immersion Gold, 89%
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: LPI
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA N/A
FLAMIBILITY RATING 94V-0
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold

Typical Applications:

1. Chip testers

2. Dielectric polarizers and lenses

3. Filters and coupler

4. Global Positioning Systems Antennas

5. Patch Antennas

6. Power amplifiers and combiners

7. RF and microwave circuitry

8. Satellite communication systems

Our Capability (TMM4)

PCB Material: Composite of Ceramic, hydrocarbon and thermoset polymer
Designator: TMM4
Dielectric constant: 4.5 ±0.045 (process); 4.7 (design)
Layer count: 1 Layer, 2 Layer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion tin, Pure gold (no nickle under gold), OSP.

Data Sheet of TMM4

Property TMM4 Direction Units Condition Test Method
Dielectric Constant,εProcess 4.5±0.045 Z 10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 4.7 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.002 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant +15 - ppm/°K -55-125 IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 6 x 108 - Mohm.cm - ASTM D257
Surface Resistivity 1 x 109 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 371 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 TGA - ASTM D3850
Coefficient of Thermal Expansion - x 16 X ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 16 Y ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 21 Z ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.7 Z W/m/K 80 ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.7 (1.0) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 15.91 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.76 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.07 - % D/24/23 ASTM D570
3.18mm (0.125") 0.18
Specific Gravity 2.07 - - A ASTM D792
Specific Heat Capacity 0.83 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -
TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold
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TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold

Ask Latest Price
Brand Name :
Bicheng Technologies Limited
Model Number :
BIC-105-V6
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD 9.99-99.99
Contact Supplier
TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold
TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold
TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold

Shenzhen Bicheng Electronics Technology Co., Ltd

Site Member
9 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Site Member
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