Specifications
Brand Name :
Bicheng Technologies Limited
Model Number :
BIC-154-V0.96
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD 9.99-99.99
Payment Terms :
T/T, Western Union
Supply Ability :
50000 pieces per month
Delivery Time :
10 working days
Packaging Details :
Vacuum
Number of Layers :
2
Glass Epoxy: :
TMM10i
Final foil :
1.0 Oz
Final height of PCB: :
2.0 mm ±10%
Surface Finish :
Immersion Gold
Solder Mask Color: :
N/A
Colour of Component Legend :
N/A
Test :
100% Electrical Test prior shipment
Description

Rogers TMM10i Microwave Printed Circuit Board 75mil 1.905mm RF PCB With Pure Gold Plated.

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description

This type of Microwave PCB is built on 75mil TMM10i substrate with 1oz copper(finished). It is a double layer board without solder mask and silkscreen. The surface finish on pads is pure gold plated with 80 micro inches, no nickle under gold. The boards are manufactured as per IPC Class II standard, every 25 boards are packed for shipment.

PCB Specifications

PCB SIZE 75 x 68mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 17um(0.5 oz)+plate TOP layer
TMM10i 1.905mm
copper ------- 17um(0.5 oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 10 mil / 10 mil
Minimum / Maximum Holes: 0.45 mm / 3.50 mm
Number of Different Holes: 3
Number of Drill Holes: 3
Number of Milled Slots: 0
Number of Internal Cutouts: no
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: TMM10i 1.905mm
Final foil external: 1.0 oz
Final foil internal: N/A
Final height of PCB: 2.0 mm ±0.1
PLATING AND COATING
Surface Finish Pure Gold-Plated (No nickle under gold), 52%
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.45mm.
FLAMIBILITY RATING 94V-0
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Rogers TMM10i Microwave Printed Circuit Board 75mil 1.905mm RF PCB With Pure Gold Plated.

Typical Applications

1. Chip testers

2. Dielectric polarizers and lenses

3. Filters and coupler

4. Global Positioning Systems Antennas

5. Patch Antennas

6. Power amplifiers and combiners

7. RF and microwave circuitry

8. Satellite communication systems

Our PCB Capability(TMM10i)

PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM10i
Dielectric constant: 9.80 ±0.245
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion tin, OSP, Pure Gold Plated (No Nickle under gold) etc..

Data Sheet of TMM10i

Property TMM10i Direction Units Condition Test Method
Dielectric Constant,εProcess 9.80±0.245 Z 10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 9.9 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.002 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant -43 - ppm/°K -55-125 IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 108 - Mohm.cm - ASTM D257
Surface Resistivity 4 x 107 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 267 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 TGA - ASTM D3850
Coefficient of Thermal Expansion - x 19 X ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 19 Y ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 20 Z ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.76 Z W/m/K 80 ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.0 (0.9) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) - X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.8 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.16 - % D/24/23 ASTM D570
3.18mm (0.125") 0.13
Specific Gravity 2.77 - - A ASTM D792
Specific Heat Capacity 0.72 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -
Rogers TMM10i Microwave Printed Circuit Board 75mil 1.905mm RF PCB With Pure Gold Plated.
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Rogers TMM10i Microwave Printed Circuit Board 75mil 1.905mm RF PCB With Pure Gold Plated.

Ask Latest Price
Brand Name :
Bicheng Technologies Limited
Model Number :
BIC-154-V0.96
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD 9.99-99.99
Contact Supplier
Rogers TMM10i Microwave Printed Circuit Board 75mil 1.905mm RF PCB With Pure Gold Plated.
Rogers TMM10i Microwave Printed Circuit Board 75mil 1.905mm RF PCB With Pure Gold Plated.

Shenzhen Bicheng Electronics Technology Co., Ltd

Site Member
9 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Site Member
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