Impedance Controlled PCB 12 Layers High Tg Printed Circuit Board HDI Multilayer PCB Board On 2.0mm FR-4

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

1.1 General description

This is a type of impedance controlled PCB built on FR-4 material with Tg 175°C for the application of Signal transmission. It's a 12-layer board with 2.0 mm thick. It contains 2+N+2 HDI vias (see the stackup & vias). White silkscreens (Taiyo) are on green solder mask (Taiyo) and immersion gold on pads. Both Signal trace impedance and differential pairs impedance are controlled on layers. See the drawing below. The base material is from ITEQ. Entire panel is supplying with single up. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards are packed for shipment.

Signal Trace Impedance Control

Differential Pairs Impedance Control

1.2 Features and benefits

Lead free assemblies with a maximum reflow temperature of 260℃.

Long storage time ( It can be stored for more than 1 year in vacuum bag)

Improved the speed of signal transmission

PCB manufacturing on required specifications.

Quick and on-time delivery

UL recognized and RoHS Directive-compliant

Prototype PCB capability

1.3 Applications

Dsl Modem

Solar Battery Charger

Vehicle Tracker

GPS Receiver

Wi Fi Antenna

Bluetooth USB Hub

USB Wireless Router

SMS Modem

Multicoupler Antenna

Phone systems

1.4 Parameter and data sheet

1.5 Impedance PCB and Impedance Match

The characteristic impedance of the conductor on the printed circuit board is an important indicator of the circuit design, especially in the PCB design of high frequency circuit. Whether the characteristic impedance of the conductor is consistent and matching with the characteristic impedance required by the device or signal must be taken into consideration. Therefore, these two concepts in reliability design of PCB design must be paid attention.

There will be a variety of signal transmission in the conductor of circuit board. To increase the rate of transmission, it must increase its frequency. Due to the factors of the circuit itself such as etching, stack thickness, track width and so on are different, it will cause changes of the impedance value, resulting in its signal distortion. Therefore, the impedance value of conductor on high-speed circuit board should be controlled within a certain range, known as the "impedance control". The factors that affect the impedance of the PCB wiring are mainly the width of the copper track, the thickness of the copper track, the dielectric constant of the dielectric, the thickness of the dielectric, the thickness of the pad, the path of the ground layer, the wires around the wiring, etc. So the impedance of the wiring on the board must be controlled in the design of the PCB to avoid signal reflection and other electromagnetic interference and signal integrity issues as far as possible, to guarantee the stability of the actual use of the PCB board. You can refer to the corresponding empirical formula for the calculation method of micro-strip line and strip line impedance on PCB board.