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High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
Specifications
Brand Name :
Bicheng Technologies Limited
Model Number :
BIC-480-V6.09
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD 9.99-99.99
Payment Terms :
T/T, Paypal
Supply Ability :
45000 pieces per month
Delivery Time :
10 working days
Packaging Details :
Vacuum
Board Material :
FR-4
Board Thickness :
2.0mm
Surface Cu thickness :
35 µm (1 oz)
Surface Finish :
Immersion Gold
Coverlay Colour :
Green
Color of Silkscreen :
White
Function :
100% Pass electrical test
Description

High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold

1.1 General description

This is a type of 14-layer HDI printed circuit board built on FR-4 Tg170 substrate for the application of codec equipment. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. The PCBs contains 2+N+2 high density interconnection layers, microvias on different layers are stacked. The base material is from ITEQ supplying in 1 up board per panel.They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panels are packed for shipment.

1.2 Our Advantages

1. ISO9001, ISO14001, IATF16949, UL Certified;

2. Prototype to volume Production Capability;

3. 16000㎡ workshop;

4. 30000㎡ output capability per month;

5. 8000 types of PCB's per month;

6. IPC Class 2 / IPC Class 3;

7. Eligible products rate of first production: >95%

1.3 Applications of HDI PCBs

Automotive, GPS Trackers

5G WiFi, Embedded Systems Basics

Smartphones and tablets

Wearable technology and Healthcare

Access Control Solutions and Aerospace

High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold

1.4 Parameter and data sheet

Number of Layers 14-Layer
Board Type Multilayer PCB
Board size 220mm x 170mm=4PCS
Board Thickness 2.0 mm +/-0.16
Board Material FR-4
Board Material Supplier ITEQ
Tg Value of Board Material 170℃
PTH Cu thickness ≥20 um
Inner Iayer Cu thicknes 18 um (0.5oz)
Surface Cu thickness 35 um (1oz)
Solder Mask Type and Model No. LPSM, PSR-2000GT600D
Solder Mask Supplier TAIYO
Solder Mask Colour Green
Number of Solder Masks 2
Thickness of Solder Mask 14 um
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
Mininum Trace (mil) 5.8 mil
Minimum Gap(mil) 6.2 mil
Surface Finish Immersion Gold
RoHS Required Yes
Warpage 0.25%
Thermal Shock Test Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Solderablity Test Pass, 255±5℃,5 seconds Wetting Area Least 95%
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6012C Class 2

High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold

1.5 Different Types of HDI PCBs

To simplify the high density interconnect PCB, we define 3 types of HDI PCBs as below:

1+N+1, PCBs contain 1-time laser drill and pressing in the HDI boards.

I+N+I (I≥2), PCBs contain 2-time laser drill and pressing or more times laser drill and pressing, including the microvias staggered or stacked on different layers.

Any layer HDI, blind vias and buried vias can be freely put on different layers as designer want.

High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold

Product tags

high density interconnect pcb

,

smd pcb

,

smd pcb design
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High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold

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Product Detail
Brand Name :
Bicheng Technologies Limited
Model Number :
BIC-480-V6.09
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD 9.99-99.99
Contact Supplier
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold
High Density Interconnect (HDI) PCB Circuit Board Built on 14-Layer FR-4 Tg170℃ With Immersion Gold

Shenzhen Bicheng Electronics Technology Co., Ltd

Site Member
9 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
High Frequency PCB, Rogers PCB Board, Taconic PCB Board
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Site Member
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