New High-Performance PCB Released

A new printed circuit board (PCB) designed for demanding applications has been launched by our company. This 2-layer PCB features a RO4534 hydrocarbon ceramic/woven glass laminate manufactured with a dielectric constant of 3.4. The material's excellent thermal conductivity and wide -40°C to +85°C operating temperature range make it suitable for rugged environments.

The PCB has been constructed with a stackup of 35um finished copper on both sides of a 60 mil (1.524mm) RO4534 core. With 1 oz finished copper weight, optimal current-carrying capacity and heat dissipation are provided by the board.

Key construction characteristics include:

• Board dimensions of 170.66mm x 70.33mm were used
• A minimum trace/space of 4/4 mils was implemented
• A 0.4mm minimum hole size was utilized
• The thickness was made to be 1.6mm
• 1 mil via plating was incorporated
• An immersion gold surface finish was applied
• 100% electrical testing was completed

The PCB design has had several high-reliability features included such as lead-free fabrication processes, resin-filled vias, and solder masks on both sides. It has been fabricated to meet IPC Class 2 standards for optimal quality.

With 173 components, 200 total pads, and 161 vias packed into a compact footprint, complex circuit designs are enabled by this PCB. Exceptional thermal transfer and structural integrity are provided by the resin-filled vias.

This advanced PCB has undergone design, fabrication, and testing to deliver reliable performance in demanding applications. Its high-end materials and robust design parameters make it an ideal choice for use in aerospace, defense, industrial, and other rugged operating environments.

Any additional technical information on this new PCB product can be obtained by contacting Sally Mao at sales30@bichengpcb.com. We look forward to this board being supplied for your most challenging circuit applications.