Flexible PCB with Polyimide Stiffener Flexible Printed Circuit (FPC) with PI Stiffener

(FPC’s are custom-made products, the picture and parameters shown are just for reference)

General description

This is a type of single layer flexible printed circuit for the application of Wireless Dongle, 0.2mm thick. The base laminate is from Shengyi, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. Polyimide stiffener is applied on the inserting head.

Parameter and data sheet

Features and benefits

Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

Low cost

Continuity of processing

Focus on low to medium volume production

More than 18 years of experience

Applications

Mobile phone built-in antenna FPC, flex keyboard for mobile phone keys, Industrial control computer soft board

Stiffener

In many applications where there are components soldered, the flexible boards require external stiffeners (Stiffener, also known as the reinforcing board) for external support. The stiffener materials are PI or Polyester film, glass fiber, polymer materials, steel foil, aluminum shim and so on.

(1) PI or Polyester

PI and polyester films are commonly used stiffener materials for flexible circuit board. The commonly used thickness is 125μm (5mil), some hardness can be obtained.

(2) Glass fibers

Glass fibers (such as FR-4), which are also commonly used materials for stiffeners. The fiber glass stiffener has a higher hardness than that of PI or Polyester, used where the requirements of harness is higher. The thickness range is typically 125μm (5mil) to 3.175mm (125mils). However, its processing is relatively difficult than PI, and may not be a standing material for some FPC factories.

(3) Polymer

Polymer, such as plastic, etc. is also used as stiffeners.

Its water absorption is low, with high pressure and high temperature resistance.

(4) Steel foil, aluminum shim

The support hardness of steel foil, aluminum shim is high, the heat can also be dissipated. The hardness or heat dissipation in the design is the main concern.

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