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Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4
Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4
Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4
Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4
Specifications
Brand Name :
Bicheng Technologies Limited
Model Number :
BIC-83-V1.23
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD 9.99-99.99
Payment Terms :
T/T
Supply Ability :
50000 pieces per month
Delivery Time :
10 working days
Packaging Details :
Vacuum
Number of Layers :
4 Layer, 6 Layer, Multilayer, Hybrid type (Mixed)
Glass Epoxy :
RO4350B Rogers
Final foil :
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Final height of PCB :
1.0-5.0mm
Surface Finish :
Bare copper, HASL, ENIG, Silver, OSP,etc.
Solder Mask Color :
Green, Black, Blue, Yellow, Red etc.
Colour of Component Legend :
Green, Black, Blue, Yellow, Red etc.
Test :
100% Electrical Test prior shipment
Description

Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4

(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)

Hello everyone,

Warm greetings!

Today we’re introducing a type of 6-layer RF PCB built on 12mil RO4003C and FR-4. This board is used for satellite antenna. Following drawing is the stack-up of the board.

Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4

Viewing from the stack-up, the 12mil core is on the top layer and it mainly plays the roles of signal layer. The core has fixed thickness which is very important to the electrical length of RF lines on the circuit board. The rest layers are FR-4 epoxy glass material with similar thickness with RO4003C.

The detailed specifications are as follows.

Base material: 12mil 0.305mm RO4003C+ Tg170 FR-4

Dielectric constant: 3.38+/-0.05

Layer count: 6 layers

Via type: Through holes

Format: 105mm x 80mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35μm / Inner layer 18μm

Solder mask / Legend: Green / White

Final PCB height: 1.4 mm

Others: Impedance controlled PCB

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 10 working days

Shelf life: 6 months

Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4

At present, the mature mixed pressing materials are as follows:

RO4350B + FR4;

RO4003C + FR4;

F4B + FR4;

RT/duroid 5880 + RO4350B

RT/duroid 5880 + FR4

Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.

Appendix: Our PCB Capability 2022

Parameter Value
　Layer Counts　 1-32
　Substrate Material RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
　Maximum Size 　Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
　Board Outline Tolerance 　±0.0059" (0.15mm)
　PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm) 　±8%
Thickness Tolerance(t＜0.8mm) 　±10%
　Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
　Minimum Track 0.003" (0.075mm)
　Minimum Space 　0.003" (0.075mm)
　Outer Copper Thickness 　35µm--420µm (1oz-12oz)
　Inner Copper Thickness 　17µm--350µm (0.5oz - 10oz)
　Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
　Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
　Registration (Mechanical) 0.00197" (0.05mm)
　Aspect Ratio 　12:1
　Solder Mask Type 　LPI
　Min Soldermask Bridge 0.00315" (0.08mm)
　Min Soldermask Clearance 0.00197" (0.05mm)
　Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance 　±10%
　Surface Finish HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc.
Product tags

fr4 multilayer pcb

,

fr4 single layer pcb

,

high frequency pcb design
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Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4

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Product Detail
Brand Name :
Bicheng Technologies Limited
Model Number :
BIC-83-V1.23
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD 9.99-99.99
Contact Supplier
Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4
Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4

Shenzhen Bicheng Electronics Technology Co., Ltd

Site Member
9 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
High Frequency PCB, Rogers PCB Board, Taconic PCB Board
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Site Member
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