Specifications
Brand Name :
Bicheng Technologies Limited
Model Number :
BIC-0095-V1.35
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD 9.99-99.99
Payment Terms :
T/T, Paypal
Supply Ability :
50000 pieces per month
Delivery Time :
10 working days
Packaging Details :
Vacuum
Number of Layers :
1 Layer, 2 Layer, Multilayer, Hybrid PCB
Glass Epoxy :
RO3003
Final height of PCB :
10mil (0.254mm), 20mil (0.508mm) 30mil (0.762mm), 60mil (1.524mm)
Final foil external :
0.5oz, 1oz, 2oz
Surface Finish :
Bare copper, HASL, ENIG, OSP etc..
Solder Mask Color :
Green, Black, Blue, Yellow, Red etc.
Colour of Component Legend :
Green, Black, Blue, Yellow, Red etc.
Test :
100% Electrical Test prior shipment
Description

Hello Everyone,

Today we’re talk about RO3003 high frequency PCBs.

RO3003 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. This allows our designers to develop multi-layer board design feeling free and free, without encountering warpage or reliability problems.

Let’s see some more features and applications.

Rogers RO3003 High Frequency Printed Circuit Board Rogers DK3.0 GPS Antenna RF PCB

Firstly, low dielectric loss, DF=0.001, it can be used in applications up to 77 GHz.

Secondly, Stable dielectric constant versus temperature and frequency, it’s ideal material for band pass filters, microstrip patch antennas, and voltage controlled oscillators.

Thirdly, excellent mechanical properties versus temperature, it’s reliable stripline and multi-layer board constructions.

Fourthly, Uniform mechanical properties, it’s suitable for use with epoxy glass multi-layer board hybrid designs.

Fifthly, low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.

PCB Capability
PCB Material: Ceramic-filled PTFE composite
Designator: RO3003
Dielectric constant: 3.0 ±0.04 (process)
3.0 (design)
Layer count: 1 Layer, 2 Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm)
30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..
   

RO3003 high frequency PCBs are available with double sided, multi-layer and hybrid construction, copper ranges from 0.5oz to 2oz, thickness from 0.3mm to 1.6mm, maximum size 400 by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.

Rogers RO3003 High Frequency Printed Circuit Board Rogers DK3.0 GPS Antenna RF PCB

Typical Applications

1. Automotive radar applications

2. GPS Antennas

3. Power amplifiers and antennas

4. Patch antennas for wireless communications

5. Direct broadcast satellite


Rogers RO3003 High Frequency Printed Circuit Board Rogers DK3.0 GPS Antenna RF PCB

The basic colour of RO3003 PCB is white.

The manufacturing process of RO3003 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process winning advantageous market. Should you have any questions, please feel free to contact us.

Thank you for your reading.

Appendix: Typical Value of RO3003

Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z 10 GHz/23 IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z 10 GHz/23 IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -3 Z ppm/ 10 GHz -50to 150 IPC-TM-650 2.5.5.5
Dimensional Stability 0.06
0.07
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107 COND A IPC 2.5.17.1
Tensile Modulus 930
823
X
Y
MPa 23 ASTM D 638
Moisture Absorption 0.04 % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.9 j/g/k Calculated
Thermal Conductivity 0.5 W/M/K 50 ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288
)
17
16
25
X
Y
Z
ppm/ 23/50% RH IPC-TM-650 2.4.4.1
Td 500 TGA ASTM D 3850
Density 2.1 gm/cm3 23 ASTM D 792
Copper Peel Stength 12.7 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes
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Rogers RO3003 High Frequency Printed Circuit Board Rogers DK3.0 GPS Antenna RF PCB

Ask Latest Price
Brand Name :
Bicheng Technologies Limited
Model Number :
BIC-0095-V1.35
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD 9.99-99.99
Contact Supplier
Rogers RO3003 High Frequency Printed Circuit Board Rogers DK3.0 GPS Antenna RF PCB
Rogers RO3003 High Frequency Printed Circuit Board Rogers DK3.0 GPS Antenna RF PCB
Rogers RO3003 High Frequency Printed Circuit Board Rogers DK3.0 GPS Antenna RF PCB
Rogers RO3003 High Frequency Printed Circuit Board Rogers DK3.0 GPS Antenna RF PCB
Rogers RO3003 High Frequency Printed Circuit Board Rogers DK3.0 GPS Antenna RF PCB
Rogers RO3003 High Frequency Printed Circuit Board Rogers DK3.0 GPS Antenna RF PCB

Shenzhen Bicheng Electronics Technology Co., Ltd

Site Member
9 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Site Member
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