Specifications
Brand Name :
Bicheng Technologies Limited
Model Number :
BIC-0077-V3.4
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD 9.99-99.99
Payment Terms :
T/T
Supply Ability :
50000 pieces per month
Delivery Time :
10 working days
Packaging Details :
Vacuum
Number of Layers :
4
Glass Epoxy :
RO4350B 0.101mm (4mil) and FR-4 0.25mm combined
Final foil external :
1oz
Final height of PCB :
1.0mm ±10%
Surface Finish :
Immersion Gold
Solder Mask Color :
Green
Colour of Component Legend :
White
Test :
100% Electrical Test prior shipment
Description

Hybrid PCB on Rogers RO4350B and High Tg FR-4 4-Layer 1.0mm Mixed PCB on 4mil RO4350B and 0.3mm FR-4

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

Hi Everyone,

Today, we're going to talk about a type of 4-layer high frequency PCB made on 4mil RO4350B pressed with FR-4.

The board is designed as a 4-layer structure, because 4-layer is relatively simple and cost controllable, this is helpful to open up a new market.

Let's take a look at first build-up,

Hybrid PCB Rogers RO4350B and  High Tg FR-4 4-Layer 1.0mm Mixed PCB on 4mil RO4350B and 0.3mm FR-4

The first layer to the second layer and the third layer to the fourth layer are the Rogers core 4mil (0.102mm) RO4350B, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the dielectric material in the middle is FR-4 epoxy glass, which bonds both cores on top and bottom side. Inner layer is 0.5 ounces and the outer layer is 1 ounce.

The detailed specifications of this board are as follows:

Base material: RO4350B 0.102mm + Tg 170℃ FR4 0.30mm

Layer count: 4 layers

Panel: 55mm x 132mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 um/ Inner layer 18 um

Solder mask / Legend: green / white

Final PCB height: 1.0 mm

Special technology: via in pad (hole filled) under BGA

Standard: IPC 6012 Class 2

Packing: 25 panels are packed for shipment.

Lead time: 12 working days

Shelf life: 6 months

Hybrid PCB Rogers RO4350B and  High Tg FR-4 4-Layer 1.0mm Mixed PCB on 4mil RO4350B and 0.3mm FR-4

The applications of RO4350B hybrid PCB are wide, such as preamplifier, radar sensors, digital transmitter and splitter module; GPS antenna, communications relays, analogue transmitter and 4G antennas; RF transmitter, WiFi amplifier, RFID and attenuator etc.

The advantages of RO4350B hybrid PCBs:

1) RO4350B exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications;

2) Signal integrity performance improved over the stack-ups with all FR4 board;

3) Cost reduced over stack-ups with all low loss material;

4) Reduce signal loss at high frequencies as well;

5) Benefit from our strong capabilities: meeting your PCB demands from prototype mass production and IATF 16949 (2016), ISO14001 (2015), ISO9001 (2015) and UL certified factory guarantee your quality.

That’s all of today. Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.

Appedix: Our PCB Capability (2022)
 Layer Counts  1-32
 Substrate Material RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
 Maximum Size  Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance  ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)  ±8%
Thickness Tolerance(t<0.8mm)  ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space  0.003" (0.075mm)
 Outer Copper Thickness  35µm--420µm (1oz-12oz)
 Inner Copper Thickness  17µm--350µm (0.5oz - 10oz)
 Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc.
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Hybrid PCB Rogers RO4350B and High Tg FR-4 4-Layer 1.0mm Mixed PCB on 4mil RO4350B and 0.3mm FR-4

Ask Latest Price
Brand Name :
Bicheng Technologies Limited
Model Number :
BIC-0077-V3.4
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD 9.99-99.99
Contact Supplier
Hybrid PCB Rogers RO4350B and  High Tg FR-4 4-Layer 1.0mm Mixed PCB on 4mil RO4350B and 0.3mm FR-4
Hybrid PCB Rogers RO4350B and  High Tg FR-4 4-Layer 1.0mm Mixed PCB on 4mil RO4350B and 0.3mm FR-4
Hybrid PCB Rogers RO4350B and  High Tg FR-4 4-Layer 1.0mm Mixed PCB on 4mil RO4350B and 0.3mm FR-4

Shenzhen Bicheng Electronics Technology Co., Ltd

Site Member
9 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Site Member
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