Specifications
Brand Name :
Bicheng Enterprise Limited
Model Number :
BIC-170-V1.7
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD 9.99-99.99
Payment Terms :
T/T, Payapl
Supply Ability :
50000 pieces per month
Delivery Time :
10 working days
Packaging Details :
Vacuum
Number of Layers :
2
Glass Epoxy :
PTFE
Final height of PCB :
6.0mm ±0.1
Final foil external :
1 oz
Surface Finish :
Immersion Tin
Solder Mask Color :
no
Colour of Component Legend :
no
Test :
100% Electrical Test prior shipment
Description

F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 6.0mm RF PCB With Immersion Tin

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

This product(F4BTM-1/2) is made of glass fiber cloth, nano-grade ceramic powder filling material and PTFE resin through scientific preparation and strict process suppression. The heat dissipation effect has been somewhat improved, and the thermal expansion coefficient is small. Dielectric constant ranges 2.55 to 10.2. This is also a type of thick PCB material as thick as 12mm. Here’s the typical properties of F4BTM-1/2 as follows.

Typical Properties (F4BTM-1/2)

Appearance It complies with the national military standard regulations of microwave printed circuit substrate materials
Part No. F4BTM-1/2 (255) F4BTM-1/2 (265) F4BTM-1/2 (285) F4BTM-1/2 (294) F4BTM-1/2 (300) F4BTM-1/2 (320)
F4BTM-1/2 (338) F4BTM-1/2 (350) F4BTM-1/2 (400) F4BTM-1/2 (440) F4BTM-1/2 (615) F4BTM-1/2 (1020)
Sheet Size(mm) 610 x 460 600 x 500 1220 x 914 1220 x 1000 1500 x 1000
Dielectric Thickness(mm) 0.254 ±0.025 0.508 ±0.05 0.762 ±0.05 0.787 ±0.05 1.016 ±0.05 1.27 ±0.05
1.524 ±0.05 2.0 ±0.075 3.0 ±0.09 4.0 ±0.1 5.0 ±0.1 6.0 ±0.12
9.0 ±0.18 10.0 ±0.18 12.0 ±0.2
Exfoliation strength of copper foil Normal state ≧18N/cm; Constant heat and humidity and 265℃ ±2℃ melt solder foaming for 20 seconds, no delamination and peeling strength ≧15N/cm
Thermal Stress Tin immersion, 260℃ x 10 seconds ≧3 times, no delamination, no bubble.
Chemical Properties According to the substrate characteristics, reference to the printed circuit chemical corrosion method processing circuit, and the dielectric performance of the material does not change, the hole metalliczation requires nanaphthalene solution activation treatment or plasma treatment.
Physical and electrical performance Property Test Condition Unit Value
Density Normal g/cm³ 2.1-3.0
Water Absorption Dip in 20℃±2℃ distilled water for 24 hours % ≦0.05
Operation Temperature High and low temperature box -50~+260
Coefficient of thermal conductivity W/(m·K) 0.6 - 0.9
Coefficient of Thermal Expansion -55℃ ~288℃ (DK 2.55~3.0) ppm/℃ x 15
y 15
z 65
Coefficient of Thermal Expansion -55℃ ~288℃ (DK 3.2~3.5) ppm/℃ x 15
y 15
z 55
Coefficient of Thermal Expansion -55℃ ~288℃ (DK 4.0~10.2) ppm/℃ x 12
y 14
z 50
Shrinkage Factor Cook in boiling water for 2 hours % <0.0002
Surface Resistivity 500V DC Normal State M.Ω ≧1 x 106
Constant heat and humidity ≧1 x 105
Volume Resistivity Normal State MΩ.cm ≧1 x 107
Constant Heat and Humidity ≧1 x 106
Surface Electrical Resistance Strength Normal State δ=1mm(Kv/mm) ≧1.2
Constant Heat and Humidity ≧1.1
Dielectric Constant 10GHz εr 2.85 ±0.05 2.94 ±0.05 2.55 ±0.05
3.00 ±0.05 3.20 ±0.05 2.65 ±0.05
3.38 ±0.05 3.50 ±0.05
4.00 ±0.08 4.40 ±0.1
6.15 ±0.15 10.2 ±0.25
Temperature Coefficient of Dielectric Constant Dielectric Constant Value
2.55 2.65 -90
2.85 2.94 -85
3.0 3.2 -75
3.38 -65
3.5 4.0 4.4 -60
6.15 -55
10.2 -50
Dissipation Factor 10 GHz tgδ 2.55-3.0 ≦1.5 x 10-3
tgδ 3.0-3.5 ≦2.0 x 10-2
tgδ 4.0-10.2 ≦2.5 x 10-2
Flame Retardant Resistance UL94 V-0

F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 6.0mm RF PCB With Immersion Tin

Our PCB Capability(F4BTM-1/2)

PCB Material: Fibre glass coated PTFE
Code: F4BTM-1/2 (family series)
Dielectric constant: 2.55, 2.65, 2.85, 2.94, 3.0, 3.2, 3.38, 3.5, 4.0, 4.4, 6.15, 10.2
Layer count: 1 Layer, 2 Layers and multi-layer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 31mil (0.787mm), 44mil (1.016mm), 50mil (1.27mm), 60mil (1.524mm), 79mil (2.0mm),118mil (3.0mm), 158mil (4.0mm), 197mil (5.0mm), 236mil (6.0mm), 354mil (9.0mm), 394mil (10.0mm), 472mil (12.0mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion Silver, Immersin Tin, OSP,etc.

High Frequency Materials

Rogers RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3035, RO3006, RO3010, RO3210, RO3203, etc.

Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010, RT/duroid 6035HTC etc.

Rogers TMM4, TMM10, Kappa 438 etc.

PTFE F4B (DK2.2, DK2.65, DK2.85, DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2)

Taconic TLX-0, TLX-9, TLX-8, TLX-7, TLX-6, TLY-5, TLY-3, RF-35, RF-35TC, TLF-35, RF-60A, RF-60TC, RF-35A2,RF-45, TRF-45 etc.

AD450, AD600, AD1000, TC350 etc.

F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 6.0mm RF PCB With Immersion Tin

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F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 6.0mm RF PCB With Immersion Tin

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Brand Name :
Bicheng Enterprise Limited
Model Number :
BIC-170-V1.7
Certification :
UL
Place of Origin :
China
MOQ :
1
Price :
USD 9.99-99.99
Contact Supplier
F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 6.0mm RF PCB With Immersion Tin
F4B High Frequency PCB DK 4.4 PTFE Microwave PCB 6.0mm RF PCB With Immersion Tin

Shenzhen Bicheng Electronics Technology Co., Ltd

Site Member
9 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Site Member
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