Specifications
Description

F4BM220 High Frequency PCB DK 2.2 PTFE PCB with 3.0mm Thick 1oz Copper and HASL Lead Free

(PCB's are custom-made products, the picture and parameters shown are just for reference)

Hello everybody,

Today we talk about a type of F4BM high frequency circuit board at 3.0mm thick.

F4BM series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B, mainly due to a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.

PCB Specifications

Layer count: Double sided
Base material: F4BM220 DK 2.2
Dimension: 61 x 62mm
Finished thickness 3.0mm ±10%
Finished Copper weight: 1oz
SMOBC: No
Surface finish: HASL Pb free

The main specifications of this board is double sided board, substrate is F4BM220 with DK at 2.2, 61mm long by 62mm wide, finished thickness at 3.0mm, finished copper at 1.0oz, no solder mask no silkscreen and surface finish is OSP.

Let’s see the stack-up details:

F4BM220 High Frequency PCB DK 2.2 PTFE PCB with 3.0mm Thick 1oz Copper and HASL Lead Free

Top layer and bottom layer are 1oz copper finished. F4BM220 dielectric material is in the middle of 2 layers copper, showing dielectric constant at 2.2, 3.0mm thick.

F4BM220 High Frequency PCB DK 2.2 PTFE PCB with 3.0mm Thick 1oz Copper and HASL Lead Free

This is the photo of this board. The basic colour of F4BM220 PCB is brown.

Our PCB Capability (F4BM)

PCB Material: PTFE glass fiber cloth copper clad laminates
Designation (F4BM ) F4BM DK (10GHz) DF (10 GHz)
F4BM217 2.17±0.04 0.0010
F4BM220 2.20±0.04 0.0010
F4BM233 2.33±0.04 0.0011
F4BM245 2.45±0.05 0.0012
F4BM255 2.55±0.05 0.0013
F4BM265 2.65±0.05 0.0013
F4BM275 2.75±0.05 0.0015
F4BM294 2.94±0.06 0.0016
F4BM300 3.00±0.06 0.0017
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness) 0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

The dielectric constant of F4BM material is wide, ranging 2.17 to 3.0. Board thickness ranges 0.13mm to 12.0mm. We can provide you with prototype service, small batches and mass production service.

Should you have any questions, please feel free to contact us.

Thank you for your reading.

Appendix: Data Sheet (F4BM)

Product Technical Parameters Product Model & Data Sheet
Product Features Test Conditions Unit F4BM217 F4BM220 F4BM233 F4BM245 F4BM255 F4BM265 F4BM275 F4BM294 F4BM300
Dielectric Constant (Typical) 10GHz / 2.17 2.2 2.33 2.45 2.55 2.65 2.75 2.94 3.0
Dielectric Constant Tolerance / / ±0.04 ±0.04 ±0.04 ±0.05 ±0.05 ±0.05 ±0.05 ±0.06 ±0.06
Loss Tangent (Typical) 10GHz / 0.001 0.001 0.0011 0.0012 0.0013 0.0013 0.0015 0.0016 0.0017
20GHz / 0.0014 0.0014 0.0015 0.0017 0.0018 0.0019 0.0021 0.0023 0.0025
Dielectric Constant Temperature Coefficient -55ºC~150ºC PPM/℃ -150 -142 -130 -120 -110 -100 -92 -85 -80
Peel Strength 1 OZ F4BM N/mm >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8
1 OZ F4BME N/mm >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6
Volume Resistivity Standard Condition MΩ.cm ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6
Surface Resistivity Standard Condition ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >23 >23 >23 >25 >25 >25 >28 >30 >30
Breakdown Voltage (XY direction) 5KW,500V/s KV >30 >30 >32 >32 >34 >34 >35 >36 >36
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 25, 34 25, 34 22, 30 20, 25 16, 21 14, 17 14, 16 12, 15 12, 15
Z direction -55 º~288ºC ppm/ºC 240 240 205 187 173 142 112 98 95
Thermal Stress 260℃, 10s,3 times No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination
Water Absorption 20±2℃, 24 hours % ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08
Density Room Temperature g/cm3 2.17 2.18 2.20 2.22 2.25 2.25 2.28 2.29 2.29
Long-Term Operating Temperature High-Low Temperature Chamber -55~+260 -55~+260 -55~+260 -55~+260 -55~+260 -55~+260 -55~+260 -55~+260 -55~+260
Thermal Conductivity Z direction W/(M.K) 0.24 0.24 0.28 0.30 0.33 0.36 0.38 0.41 0.42
PIM Only applicable to F4BME dBc ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159
Flammability / UL-94 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0
Material Composition / / PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

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F4BM220 High Frequency PCB DK 2.2 PTFE PCB with 3.0mm Thick 1oz Copper and HASL Lead Free

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F4BM220 High Frequency PCB DK 2.2 PTFE PCB with 3.0mm Thick 1oz Copper and HASL Lead Free

Shenzhen Bicheng Electronics Technology Co., Ltd

Site Member
9 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
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