F4BM220 High Frequency PCB DK 2.2 PTFE PCB with 3.0mm Thick 1oz Copper and HASL Lead Free
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Hello everybody,
Today we talk about a type of F4BM high frequency circuit board at 3.0mm thick.
F4BM series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B, mainly due to a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.
PCB Specifications
Layer count: | Double sided |
Base material: | F4BM220 DK 2.2 |
Dimension: | 61 x 62mm |
Finished thickness | 3.0mm ±10% |
Finished Copper weight: | 1oz |
SMOBC: | No |
Surface finish: | HASL Pb free |
The main specifications of this board is double sided board, substrate is F4BM220 with DK at 2.2, 61mm long by 62mm wide, finished thickness at 3.0mm, finished copper at 1.0oz, no solder mask no silkscreen and surface finish is OSP.
Let’s see the stack-up details:
Top layer and bottom layer are 1oz copper finished. F4BM220 dielectric material is in the middle of 2 layers copper, showing dielectric constant at 2.2, 3.0mm thick.
This is the photo of this board. The basic colour of F4BM220 PCB is brown.
Our PCB Capability (F4BM)
PCB Material: | PTFE glass fiber cloth copper clad laminates | ||
Designation (F4BM ) | F4BM | DK (10GHz) | DF (10 GHz) |
F4BM217 | 2.17±0.04 | 0.0010 | |
F4BM220 | 2.20±0.04 | 0.0010 | |
F4BM233 | 2.33±0.04 | 0.0011 | |
F4BM245 | 2.45±0.05 | 0.0012 | |
F4BM255 | 2.55±0.05 | 0.0013 | |
F4BM265 | 2.65±0.05 | 0.0013 | |
F4BM275 | 2.75±0.05 | 0.0015 | |
F4BM294 | 2.94±0.06 | 0.0016 | |
F4BM300 | 3.00±0.06 | 0.0017 | |
Layer count: | Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB | ||
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) | ||
Dielectric thickness (or overall thickness) | 0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm | ||
PCB size: | ≤400mm X 500mm | ||
Solder mask: | Green, Black, Blue, Yellow, Red etc. | ||
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. |
The dielectric constant of F4BM material is wide, ranging 2.17 to 3.0. Board thickness ranges 0.13mm to 12.0mm. We can provide you with prototype service, small batches and mass production service.
Should you have any questions, please feel free to contact us.
Thank you for your reading.
Appendix: Data Sheet (F4BM)
Product Technical Parameters | Product Model & Data Sheet | |||||||||||
Product Features | Test Conditions | Unit | F4BM217 | F4BM220 | F4BM233 | F4BM245 | F4BM255 | F4BM265 | F4BM275 | F4BM294 | F4BM300 | |
Dielectric Constant (Typical) | 10GHz | / | 2.17 | 2.2 | 2.33 | 2.45 | 2.55 | 2.65 | 2.75 | 2.94 | 3.0 | |
Dielectric Constant Tolerance | / | / | ±0.04 | ±0.04 | ±0.04 | ±0.05 | ±0.05 | ±0.05 | ±0.05 | ±0.06 | ±0.06 | |
Loss Tangent (Typical) | 10GHz | / | 0.001 | 0.001 | 0.0011 | 0.0012 | 0.0013 | 0.0013 | 0.0015 | 0.0016 | 0.0017 | |
20GHz | / | 0.0014 | 0.0014 | 0.0015 | 0.0017 | 0.0018 | 0.0019 | 0.0021 | 0.0023 | 0.0025 | ||
Dielectric Constant Temperature Coefficient | -55ºC~150ºC | PPM/℃ | -150 | -142 | -130 | -120 | -110 | -100 | -92 | -85 | -80 | |
Peel Strength | 1 OZ F4BM | N/mm | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | |
1 OZ F4BME | N/mm | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | ||
Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | |
Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | |
Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >23 | >23 | >23 | >25 | >25 | >25 | >28 | >30 | >30 | |
Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >30 | >30 | >32 | >32 | >34 | >34 | >35 | >36 | >36 | |
Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 25, 34 | 25, 34 | 22, 30 | 20, 25 | 16, 21 | 14, 17 | 14, 16 | 12, 15 | 12, 15 |
Z direction | -55 º~288ºC | ppm/ºC | 240 | 240 | 205 | 187 | 173 | 142 | 112 | 98 | 95 | |
Thermal Stress | 260℃, 10s,3 times | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | ||
Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | |
Density | Room Temperature | g/cm3 | 2.17 | 2.18 | 2.20 | 2.22 | 2.25 | 2.25 | 2.28 | 2.29 | 2.29 | |
Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55~+260 | -55~+260 | -55~+260 | -55~+260 | -55~+260 | -55~+260 | -55~+260 | -55~+260 | -55~+260 | |
Thermal Conductivity | Z direction | W/(M.K) | 0.24 | 0.24 | 0.28 | 0.30 | 0.33 | 0.36 | 0.38 | 0.41 | 0.42 | |
PIM | Only applicable to F4BME | dBc | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | |
Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | |
Material Composition | / | / | PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |