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F4BTME320 High Frequency PCB 2oz Copper 1.0mm Thick With Immersion Gold
F4BTME320 High Frequency PCB 2oz Copper 1.0mm Thick With Immersion Gold
F4BTME320 High Frequency PCB 2oz Copper 1.0mm Thick With Immersion Gold
F4BTME320 High Frequency PCB 2oz Copper 1.0mm Thick With Immersion Gold
Specifications
Description

F4BTME320 High Frequency PCB 2oz Copper 1.0mm Thick With Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction

This is a 2-layer high frequency printed circuit boards(PCB) built on Wangling F4BTME320 substrates. Both top layer and bottom layer feature 70 µm (2 oz) copper starting from 1oz plating. It supports surface mount components on top side, while through-hole components are not utilized in this design.

The technology specifications highlight a minimum trace width of 4 mil and a minimum spacing of 6 mil, allowing for precise circuit design. The surface finish is Immersion Gold, which not only enhances solderability but also provides excellent corrosion resistance. Additionally, a black solder mask is applied to the top side of the PCB, offering both durability and an appealing aesthetic while safeguarding the underlying circuitry from environmental factors.

Here are the details in the table below.

PCB SIZE 70 x 70mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 70 um(1 oz+plate) TOP layer
F4BTME320 - 1.0mm
copper ------- 70um(1 oz + plate) BOT Layer
TECHNOLOGY
Minimum Trace and Space: 4 mil / 6 mil
Minimum / Maximum Holes: 0.4 mm / 1.2 mm
Number of Different Holes: 7
Number of Drill Holes: 92
Number of Milled Slots: 2
Number of Internal Cutouts: 1
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: F4BTME320 Dk3.2
Final foil external: 2 oz
Final foil internal: N/A
Final height of PCB: 1.1 mm ±10%
PLATING AND COATING
Surface Finish Immersion Gold
Solder Mask Apply To: Top, Black
Solder Mask Color: no
Solder Mask Type: no
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend Top
Colour of Component Legend White
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

F4BTME320 High Frequency PCB 2oz Copper 1.0mm Thick With Immersion Gold

F4BTME High Frequency Laminates

F4BTME high frequency laminates are made of glass fiber cloth, nano-ceramic filling and polytetrafluoroethylene resin after scientific preparation and strict process pressing.

This series products is based on the F4BM dielectric layer, and the materials are added with high-dielectric and low-loss nanoscale ceramics, thus obtaining higher dielectric constant, better heat resistance, lower coefficient of thermal expansion, higher insulation resistance, better thermal conductivity, while maintaining the characteristics of low loss.

F4BTME is cladded with reverse treated copper foil (RTF) which has excellent PIM index, more accurate line control and lower conductor loss, optional thickness available with0.5oz and 1oz.

Data Sheet (F4BTME)

Product Technical Parameters Product Model & Data Sheet
Product Features Test Conditions Unit F4BME217 F4BME220 F4BME233 F4BME245 F4BME255 F4BME265 F4BME275 F4BME294 F4BME300
Dielectric Constant (Typical) 10GHz / 2.17 2.2 2.33 2.45 2.55 2.65 2.75 2.94 3.0
Dielectric Constant Tolerance / / ±0.04 ±0.04 ±0.04 ±0.05 ±0.05 ±0.05 ±0.05 ±0.06 ±0.06
Loss Tangent (Typical) 10GHz / 0.001 0.001 0.0011 0.0012 0.0013 0.0013 0.0015 0.0016 0.0017
20GHz / 0.0014 0.0014 0.0015 0.0017 0.0018 0.0019 0.0021 0.0023 0.0025
Dielectric Constant Temperature Coefficient -55ºC～150ºC PPM/℃ -150 -142 -130 -120 -110 -100 -92 -85 -80
Peel Strength 1 OZ F4BM N/mm >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8
1 OZ F4BME N/mm >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6
Volume Resistivity Standard Condition MΩ.cm ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6
Surface Resistivity Standard Condition MΩ ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >23 >23 >23 >25 >25 >25 >28 >30 >30
Breakdown Voltage (XY direction) 5KW,500V/s KV >30 >30 >32 >32 >34 >34 >35 >36 >36
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 25, 34 25, 34 22, 30 20, 25 16, 21 14, 17 14, 16 12, 15 12, 15
Z direction -55 º~288ºC ppm/ºC 240 240 205 187 173 142 112 98 95
Thermal Stress 260℃, 10s,3 times No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination
Water Absorption 20±2℃, 24 hours % ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08
Density Room Temperature g/cm3 2.17 2.18 2.20 2.22 2.25 2.25 2.28 2.29 2.29
Long-Term Operating Temperature High-Low Temperature Chamber ℃ -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260
Thermal Conductivity Z direction W/(M.K) 0.24 0.24 0.28 0.30 0.33 0.36 0.38 0.41 0.42
PIM Only applicable to F4BME dBc ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159
Flammability / UL-94 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0
Material Composition / / PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

Our PCB Capability (F4BTME)

PCB Material: PTFE / glass fiber cloth / Nano-ceramic filler
Designation (F4BTME ) F4BTM DK (10GHz) DF (10 GHz)
F4BTME298 2.98±0.06 0.0018
F4BTME300 3.0±0.06 0.0018
F4BTME320 3.2±0.06 0.0020
F4BTME350 3.5±0.07 0.0025
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness) 0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

F4BTME320 High Frequency PCB 2oz Copper 1.0mm Thick With Immersion Gold

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F4BTME320 High Frequency PCB 2oz Copper 1.0mm Thick With Immersion Gold

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F4BTME320 High Frequency PCB 2oz Copper 1.0mm Thick With Immersion Gold
F4BTME320 High Frequency PCB 2oz Copper 1.0mm Thick With Immersion Gold

Shenzhen Bicheng Electronics Technology Co., Ltd

Site Member
9 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
High Frequency PCB, Rogers PCB Board, Taconic PCB Board
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Site Member
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