MachineU > China Products > Electrical Equipment & Supplies > Connectors & Terminals > Connectors
F4BTMS615 High Frequency PCB 1.6mm DK6.15 F4B Substrate With Immersion Gold
F4BTMS615 High Frequency PCB 1.6mm DK6.15 F4B Substrate With Immersion Gold
Specifications
Description

F4BTMS615 High Frequency PCB 1.6mm DK6.15 F4B Substrate With Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction

This printed circuit board (PCB) is designed as a double-sided board with two layers of copper, features a compact size of 171 mm x 58 mm. It supports surface mount components on top side. The layer stackup consists of a top layer with 35 µm (1 oz) copper starting with half ounces plating, supported by a durable F4BTMS615 core material with a thickness of 1.524 mm in the middle. This PCB uses Immersion Gold and black solder mask applied to the top side.

Here are more details in the table below.

PCB SIZE 171 x 58mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 35 um(0.5 oz+plate) TOP layer
F4BTMS615 -1.524 mm
copper ------- 35 um(0.5 oz + plate) BOT Layer
TECHNOLOGY
Minimum Trace and Space: 7 mil / 6 mil
Minimum / Maximum Holes: 0.5 mm / 1.5 mm
Number of Different Holes: 5
Number of Drill Holes: 27
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: F4BTMS615 Dk6.15
Final foil external: 1oz
Final foil internal: N/A
Final height of PCB: 1.6 mm ±10%
PLATING AND COATING
Surface Finish Immersion Gold
Solder Mask Apply To: Top, Black
Solder Mask Color: no
Solder Mask Type: no
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend Top
Colour of Component Legend White
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.5mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

F4BTMS615 High Frequency PCB 1.6mm DK6.15 F4B Substrate With Immersion Gold

F4BTMS High Frequency Material

The F4BTMS series is an upgraded version of the F4BTM series. Building upon its foundation, significant technological advancements have been made in material formulation and manufacturing processes. The material now incorporates a large amount of ceramics and utilizes ultra-thin and ultra-fine fiberglass cloth reinforcement. These enhancements have greatly improved the material's performance, resulting in a wider range of dielectric constants. It is a high-reliability material suitable for aerospace applications, capable of replacing similar foreign products.

By incorporating a small amount of ultra-thin and ultra-fine fiberglass cloth reinforcement, along with a significant and uniform mixture of special nanoceramics and polytetrafluoroethylene resin, the fiberglass effect during the propagation of electromagnetic waves is minimized, reducing dielectric loss and enhancing dimensional stability. The material exhibits reduced anisotropy in the X/Y/Z directions, allowing for higher frequency usage, increased electrical strength, and improved thermal conductivity. The material also possesses excellent low coefficient of thermal expansion and stable dielectric temperature characteristics.

The F4BTMS series comes standard with RTF low roughness copper foil, which not only reduces conductor loss but also provides excellent peel strength. It can be paired with copper-based or aluminum-based options.

Features

1. Minimal dielectric constant tolerance and excellent batch-to-batch consistency.

  • Extremely low dielectric loss.
  • Stable dielectric constant and low loss within frequencies up to 40GHz, meeting the requirements of phase-sensitive applications.
  • Excellent temperature coefficient of dielectric constant and dielectric loss, maintaining frequency and phase stability between -55°C and 150°C.
  • Excellent resistance to radiation, retaining stable dielectric and physical properties even after exposure to irradiation.
  • Low outgassing performance, meeting the vacuum outgassing requirements for aerospace applications.
  • Minimal thermal expansion coefficients in the X/Y/Z directions, ensuring dimensional stability and reliable hole copper connections.
  • Improved thermal conductivity, suitable for high-power applications.
  • Excellent dimensional stability.
  • Low water absorption.

Data Sheet (F4BTMS)

Product Technical Parameters Product Models & Data Sheet
Product Features Test Conditions Unit F4BTMS220 F4BTMS233 F4BTMS255 F4BTMS265 F4BTMS294 F4BTMS300 F4BTMS350 F4BTMS430 F4BTMS450 F4BTMS615 F4BTMS1000
Dielectric Constant (Typical) 10GHz / 2.2 2.33 2.55 2.65 2.94 3.00 3.50 4.30 4.50 6.15 10.20
Dielectric Constant Tolerance / / ±0.02 ±0.03 ±0.04 ±0.04 ±0.04 ±0.04 ±0.05 ±0.09 ±0.09 ±0.12 ±0.2
Dielectric Constant (Design) 10GHz / 2.2 2.33 2.55 2.65 2.94 3.0 3.50 4.3 4.5 6.15 10.2
Loss Tangent (Typical) 10GHz / 0.0009 0.0010 0.0012 0.0012 0.0012 0.0013 0.0016 0.0015 0.0015 0.0020 0.0020
20GHz / 0.0010 0.0011 0.0013 0.0014 0.0014 0.0015 0.0019 0.0019 0.0019 0.0023 0.0023
40GHz / 0.0013 0.0015 0.0016 0.0018 0.0018 0.0019 0.0024 0.0024 0.0024 / /
Dielectric Constant Temperature Coefficient -55 º~150ºC PPM/℃ -130 -122 -92 -88 -20 -20 -39 -60 -58 -96 -320
Peel Strength 1 OZ RTF copper N/mm >2.4 >2.4 >1.8 >1.8 >1.2 >1.2 >1.2 >1.2 >1.2 >1.2 >1.2
Volume Resistivity Standard Condition MΩ.cm ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8
Surface Resistivity Standard Condition MΩ ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8 ≥1×10^8
Electrical Strength (Z direction) 5KW,500V/s KV/mm >26 >30 >32 >34 >40 >40 >42 >44 >45 >48 >23
Breakdown Voltage (XY direction) 5KW,500V/s KV >35 >38 >40 >42 >48 >52 >55 >52 >54 >55 >42
Coefficientof Thermal Expansion (X, Y direction) -55 º~288ºC ppm/ºC 40, 50 35, 40 15, 20 15, 20 10, 12 10, 11 10, 12 13, 12 12, 12 10, 12 16, 18
Coefficientof Thermal Expansion (Z direction) -55 º~288ºC ppm/ºC 290 220 80 72 22 22 20 47 45 40 32
Thermal Stress 260℃, 10s,3 times / No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination
Water Absorption 20±2℃, 24 hours % 0.02 0.02 0.025 0.025 0.02 0.025 0.03 0.08 0.08 0.1 0.03
Density Room Temperature g/cm3 2.18 2.22 2.26 2.26 2.25 2.28 2.3 2.51 2.53 2.75 3.2
Long-Term Operating Temperature High-Low Temperature Chamber ℃ -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260
Thermal Conductivity Z direction W/(M.K) 0.26 0.28 0.31 0.36 0.58 0.58 0.6 0.63 0.64 0.67 0.81
Flammability / UL-94 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0
Material Composition / / PTFE,Ultra-thin and ultra-fine (quartz) fiberglass. PTFE,Ultra-thin and ultra-fine fiberglass, ceramics.

Our PCB Capability (F4BTMS)

PCB Material: PTFE,Ultra-thin and ultra-fine fiberglass, ceramics.
Designation (F4BTMS ) F4BTMS DK (10GHz) DF (10 GHz)
F4BTMS220 2.2±0.02 0.0009
F4BTMS233 2.33±0.03 0.0010
F4BTMS255 2.55±0.04 0.0012
F4BTMS265 2.65±0.04 0.0012
F4BTMS294 2.94±0.04 0.0012
F4BTMS300 3.0±0.04 0.0013
F4BTMS350 3.5±0.05 0.0016
F4BTMS430 4.3±0.09 0.0015
F4BTMS450 4.5±0.09 0.0015
F4BTMS615 6.15±0.12 0.0020
F4BTMS1000 10.2±0.2 0.0020
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness 0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil), 0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil), 1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil), 2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil), 5.08mm(200mil), 6.35mm(250mil)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

F4BTMS615 High Frequency PCB 1.6mm DK6.15 F4B Substrate With Immersion Gold

Send your message to this supplier
Send Now

F4BTMS615 High Frequency PCB 1.6mm DK6.15 F4B Substrate With Immersion Gold

Ask Latest Price
Product Detail
Contact Supplier
F4BTMS615 High Frequency PCB 1.6mm DK6.15 F4B Substrate With Immersion Gold

Shenzhen Bicheng Electronics Technology Co., Ltd

Site Member
9 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
High Frequency PCB, Rogers PCB Board, Taconic PCB Board
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Site Member
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products F4B SERIES PCBS
MachineU China Products Electrical Equipment & Supplies Connectors & Terminals Connectors
Contact Supplier
Submit Requirement