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F4BM300 High Frequency PCB 0.6mm PTFE substrates 2oz Copper With Immersion Gold
F4BM300 High Frequency PCB 0.6mm PTFE substrates 2oz Copper With Immersion Gold
Specifications
Description

F4BM300 High Frequency PCB 0.6mm PTFE substrates 2oz Copper With Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction

This PCB features a square design with dimensions of 85mm x 85 mm, utilizing a double-sided layout that contains two layers of copper. It is compatible with surface mount components, while through-hole components are not included in this design.

The layer stackup consists of a top layer made of 70 µm (2 oz) copper starting with 1oz plating, along with a durable F4BM300 core material that has a thickness of 0.508 mm. The bottom layer also incorporates 70 µm (1 oz) copper with plating, ensuring reliable performance.

The surface finish is Immersion Gold, which enhances solderability and provides excellent protection against corrosion. A black solder mask is applied to the top side of the PCB, offering both durability and a sleek appearance while safeguarding the underlying circuitry.

Here are details in table below.

PCB SIZE 85 x 85mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 70um (1 oz+plate) TOP layer
F4BM300 - 0.508mm
copper ------- 70um(1 oz + plate) BOT Layer
TECHNOLOGY
Minimum Trace and Space: 5 mil / 8 mil
Minimum / Maximum Holes: 0.3 mm / 1.2 mm
Number of Different Holes: 5
Number of Drill Holes: 79
Number of Milled Slots: 2
Number of Internal Cutouts: 2
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: F4BM300 DK 3.0
Final foil external: 2oz
Final foil internal: N/A
Final height of PCB: 0.6 mm ±10%
PLATING AND COATING
Surface Finish Immersion gold
Solder Mask Apply To: Top
Solder Mask Color: Black
Solder Mask Type: no
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend Top
Colour of Component Legend White
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Non-Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

F4BM300 High Frequency PCB 0.6mm PTFE substrates 2oz Copper With Immersion Gold

F4BM High Frequency Laminates

F4BM series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B, mainly due to a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.

Features & Benefits

-DK options available: 2.17 to 3.0, customizable DK

-Low loss

-F4BME paired with RTF copper foil, excellent PIM performance

-Diverse sizes, cost-effective

-Radiation resistance, low outgassing

-Commercialized, large-scale production, high cost-effectiveness

Typical Applications

Microwave, RF, radar

Phase shifter, passive components

Power divider, coupler and combiner

Feed network, phased array antenna

Satellite communication, base station antenna

Our PCB Capability (F4BM)

PCB Material: PTFE glass fiber cloth copper clad laminates
Designation (F4BM ) F4BM DK (10GHz) DF (10 GHz)
F4BM217 2.17±0.04 0.0010
F4BM220 2.20±0.04 0.0010
F4BM233 2.33±0.04 0.0011
F4BM245 2.45±0.05 0.0012
F4BM255 2.55±0.05 0.0013
F4BM265 2.65±0.05 0.0013
F4BM275 2.75±0.05 0.0015
F4BM294 2.94±0.06 0.0016
F4BM300 3.00±0.06 0.0017
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness) 0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

F4BM300 High Frequency PCB 0.6mm PTFE substrates 2oz Copper With Immersion Gold

Data Sheet (F4BM)

Product Technical Parameters Product Model & Data Sheet
Product Features Test Conditions Unit F4BM217 F4BM220 F4BM233 F4BM245 F4BM255 F4BM265 F4BM275 F4BM294 F4BM300
Dielectric Constant (Typical) 10GHz / 2.17 2.2 2.33 2.45 2.55 2.65 2.75 2.94 3.0
Dielectric Constant Tolerance / / ±0.04 ±0.04 ±0.04 ±0.05 ±0.05 ±0.05 ±0.05 ±0.06 ±0.06
Loss Tangent (Typical) 10GHz / 0.001 0.001 0.0011 0.0012 0.0013 0.0013 0.0015 0.0016 0.0017
20GHz / 0.0014 0.0014 0.0015 0.0017 0.0018 0.0019 0.0021 0.0023 0.0025
Dielectric Constant Temperature Coefficient -55ºC～150ºC PPM/℃ -150 -142 -130 -120 -110 -100 -92 -85 -80
Peel Strength 1 OZ F4BM N/mm >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8
1 OZ F4BME N/mm >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6
Volume Resistivity Standard Condition MΩ.cm ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6
Surface Resistivity Standard Condition MΩ ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >23 >23 >23 >25 >25 >25 >28 >30 >30
Breakdown Voltage (XY direction) 5KW,500V/s KV >30 >30 >32 >32 >34 >34 >35 >36 >36
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 25, 34 25, 34 22, 30 20, 25 16, 21 14, 17 14, 16 12, 15 12, 15
Z direction -55 º~288ºC ppm/ºC 240 240 205 187 173 142 112 98 95
Thermal Stress 260℃, 10s,3 times No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination
Water Absorption 20±2℃, 24 hours % ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08
Density Room Temperature g/cm3 2.17 2.18 2.20 2.22 2.25 2.25 2.28 2.29 2.29
Long-Term Operating Temperature High-Low Temperature Chamber ℃ -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260 -55～+260
Thermal Conductivity Z direction W/(M.K) 0.24 0.24 0.28 0.30 0.33 0.36 0.38 0.41 0.42
PIM Only applicable to F4BME dBc ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159
Flammability / UL-94 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0
Material Composition / / PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

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F4BM300 High Frequency PCB 0.6mm PTFE substrates 2oz Copper With Immersion Gold

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F4BM300 High Frequency PCB 0.6mm PTFE substrates 2oz Copper With Immersion Gold

Shenzhen Bicheng Electronics Technology Co., Ltd

Site Member
9 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
High Frequency PCB, Rogers PCB Board, Taconic PCB Board
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Site Member
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