F4BTM320 High Frequency PCB 2oz Copper 1.27mm Substrates With Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction

This PCB features a size of 110mm x 76mm and is designed as a double-sided layout with two layers. It accommodates surface mount components while excluding through-hole components. The layer stackup includes a top layer of 70 µm (2 oz) copper with starting 1oz plating, supported by a robust F4BTM320 core material of 1.27mm thickness, and a bottom layer of the same copper specifications for consistent performance.

The PCB allows for a minimum trace width of 5 mil and a minimum spacing of 9 mil, facilitating precise circuit design. The surface finish is Immersion Gold, ensuring excellent solderability and durability. Both the top and bottom sides are coated with a black solder mask, providing protection and aesthetic appeal, while white silkscreen is applied to the top side for clear labeling and identification.

Here are details in table below.

F4BTM High Frequency Laminates

F4BTM series laminates are made by scientifically formulating fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene resin, followed by strict pressing processes. The series is based on the F4BM dielectric layer, with the addition of high dielectric and low loss nano-level ceramics, resulting in higher dielectric constant, improved heat resistance, lower thermal expansion coefficient, higher insulation resistance, and better thermal conductivity, while maintaining low loss characteristics. Optional copper foil is available with ED copper in thicknesses of 0.5 oz, 1 oz, 1.5 oz, and 2 oz.

Features & Benefits

DK 2.98-3.5 optional

Adding ceramic improves performance

Excellent PIM indicators

Rich thickness ranging 0.254mm to 12mm

Diversified size 460mm x 610mm to 914mm x 1220mm

Cost saving

Commercialization for mass production

High cost performance

Anti radiation

Low exhaust

Our PCB Capability (F4BTM)

Data Sheet (F4BTM)