Specifications
Description

F4BME265 High Frequency PCB DK2.65 PTFE Double Sided With OSP and Green Mask

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction

The PCB we discussed today has a size of 89mm x 61mm, with just 1 piece in a panel. It's a double sided PCB, meaning it has two conductive layers for circuitry. There are no surface mount components on this PCB. Instead, it has through hole components. The layer stackup consists of copper layers with a finished thickness of 35um (equivalent to 1oz). In between, there is F4BME265 material with a thickness of 1.5mm, and then another copper layer of the same 35um (1oz) thickness on the other side after its plating.

Here’s more details in the table.


PCB Specifications

PCB SIZE 89 x 61mm=1PCS
BOARD TYPE Microwave PCB
Number of Layers Double sided PCB
Surface Mount Components NO
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5oz)+PLATE
F4BME265 1.524mm
copper ------- 18um(0.5oz)+PLATE
TECHNOLOGY
Minimum Trace and Space: 6mil/9mil
Minimum / Maximum Holes: 0.9/2.3mm
Number of Different Holes: 3
Number of Drill Holes: 156
Number of Milled Slots: 0
Number of Internal Cutouts: 1
Impedance Control no
BOARD MATERIAL
Glass Epoxy: F4BME265 dk2.65
Final foil external: 1oz
Final foil internal: 1oz
Final height of PCB: 1.6 mm ±0.16
PLATING AND COATING
Surface Finish OSP, Thickness >0.2µm
Solder Mask Apply To: TOP, 12micron Minimum
Solder Mask Color: Gloss Green, Taiyo PSR-2000GT600D
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend No silkscreen required.
Colour of Component Legend No silkscreen required.
Manufacturer Name or Logo: No silkscreen required.
VIA Plated through hole(PTH), via open.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

F4BME265 High Frequency PCB DK2.65 PTFE Double Sided With OSP and Green Mask

F4BME High Frequency Laminates

F4BME series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B, mainly due to a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.

Product Features

◆ DK2.17 ~ 3.0 is optional, and DK can be customized

◆ Low loss

◆ F4BME with RTF copper foil has excellent PIM index

◆ Diversified size and cost saving

◆ Irradiation resistance and low exhaust

◆ Commercialization, mass production and high cost performance

Typical Applications

◆ Microwave, RF, radar

◆ Phase shifter, passive components

◆ Power divider, coupler and combiner

◆ Feed network, phased array antenna

◆ Satellite communication, base station antenna

Data Sheet (F4BME)

Product Technical Parameters Product Model & Data Sheet
Product Features Test Conditions Unit F4BME217 F4BME220 F4BME233 F4BME245 F4BME255 F4BME265 F4BME275 F4BME294 F4BME300
Dielectric Constant (Typical) 10GHz / 2.17 2.2 2.33 2.45 2.55 2.65 2.75 2.94 3.0
Dielectric Constant Tolerance / / ±0.04 ±0.04 ±0.04 ±0.05 ±0.05 ±0.05 ±0.05 ±0.06 ±0.06
Loss Tangent (Typical) 10GHz / 0.001 0.001 0.0011 0.0012 0.0013 0.0013 0.0015 0.0016 0.0017
20GHz / 0.0014 0.0014 0.0015 0.0017 0.0018 0.0019 0.0021 0.0023 0.0025
Dielectric Constant Temperature Coefficient -55ºC~150ºC PPM/℃ -150 -142 -130 -120 -110 -100 -92 -85 -80
Peel Strength 1 OZ F4BM N/mm >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8 >1.8
1 OZ F4BME N/mm >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6 >1.6
Volume Resistivity Standard Condition MΩ.cm ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6 ≥6×10^6
Surface Resistivity Standard Condition ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >23 >23 >23 >25 >25 >25 >28 >30 >30
Breakdown Voltage (XY direction) 5KW,500V/s KV >30 >30 >32 >32 >34 >34 >35 >36 >36
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 25, 34 25, 34 22, 30 20, 25 16, 21 14, 17 14, 16 12, 15 12, 15
Z direction -55 º~288ºC ppm/ºC 240 240 205 187 173 142 112 98 95
Thermal Stress 260℃, 10s,3 times No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination No delamination
Water Absorption 20±2℃, 24 hours % ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08 ≤0.08
Density Room Temperature g/cm3 2.17 2.18 2.20 2.22 2.25 2.25 2.28 2.29 2.29
Long-Term Operating Temperature High-Low Temperature Chamber -55~+260 -55~+260 -55~+260 -55~+260 -55~+260 -55~+260 -55~+260 -55~+260 -55~+260
Thermal Conductivity Z direction W/(M.K) 0.24 0.24 0.28 0.30 0.33 0.36 0.38 0.41 0.42
PIM Only applicable to F4BME dBc ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159 ≤-159
Flammability / UL-94 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0
Material Composition / / PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

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F4BME265 High Frequency PCB DK2.65 PTFE Double Sided With OSP and Green Mask

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F4BME265 High Frequency PCB DK2.65 PTFE Double Sided With OSP and Green Mask
F4BME265 High Frequency PCB DK2.65 PTFE Double Sided With OSP and Green Mask
F4BME265 High Frequency PCB DK2.65 PTFE Double Sided With OSP and Green Mask
F4BME265 High Frequency PCB DK2.65 PTFE Double Sided With OSP and Green Mask

Shenzhen Bicheng Electronics Technology Co., Ltd

Site Member
9 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
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