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F4BTME300 High Frequency PCB PTFE RF PCB Built on 3.0mm thick with Immersion Silver
F4BTME300 High Frequency PCB PTFE RF PCB Built on 3.0mm thick with Immersion Silver
Specifications
Description

F4BTME300 High Frequency PCB PTFE RF PCB Built on 3.0mm thick with Immersion Silver

(PCB's are custom-made products, the picture and parameters shown are just for reference)

Hello everybody,

Today we talk about a type of F4BTME high frequency circuit board - F4BTME300 PCB.

This PCB features a size of 170 mm x 95 mm and is designed as a double-sided board with two layers. It supports surface mount components, while through-hole components are not included in this design. The layer stackup consists of a top layer with 35 µm (1 oz) copper starting with 0.5oz plating, paired with a core material of F4BTME300 that is 3.0 mm thick. The bottom layer also comprises 35 µm (1 oz) copper with plating. This PCB uses immersion silver, providing excellent solderability and protection. Notably, there is no solder mask applied to this board, allowing for direct access to the copper layers.

PCB Specifications

PCB SIZE 170 x 95mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 35um(0.5 oz+plate )TOP layer
F4BTME300 -3.0mm
copper ------- 35um(0.5 oz + plate) BOT Layer
TECHNOLOGY
Minimum Trace and Space: 7 mil / 7 mil
Minimum / Maximum Holes: 0.5 mm / 0.6 mm
Number of Different Holes: 5
Number of Drill Holes: 16
Number of Milled Slots: 0
Number of Internal Cutouts: 2
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: F4BTME300 DK 3.0
Final foil external: 1oz
Final foil internal: N/A
Final height of PCB: 3.1 mm ±10%
PLATING AND COATING
Surface Finish Immersion silver
Solder Mask Apply To: no
Solder Mask Color: no
Solder Mask Type: no
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend NO
Colour of Component Legend NO
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Non-Plated through hole(PTH), minimum size 0.5mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

F4BTME300 High Frequency PCB PTFE RF PCB Built on 3.0mm thick with Immersion Silver

The basic color of F4BTME300 PCB is brown.

F4BTME High Frequency Laminates

The F4BTME series laminates are manufactured through a meticulous process that involves the scientific formulation of glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin.

These substrates are built upon the F4BM dielectric layer and incorporate high dielectric constant and low loss nano-ceramics. This integration results in enhanced dielectric constant, superior heat resistance, reduced thermal expansion coefficient, increased insulation resistance, and improved thermal conductivity, all while maintaining low loss characteristics.

Furthermore, F4BTME laminates are specifically paired with reverse-treated RTF copper foil, providing exceptional performance in terms of PIM, precise line control, and minimized conductor loss.

The dielectric constant ranges from 2.98 to 3.5 and ED Copper foil available with 0.5oz, 1oz, 1.5oz and 2oz, RTF copper available with 0.5oz and 1oz; thickness available of from 0.254mm to 12.0mm.

Data Sheet (F4BTME300)

Product Technical Parameters Product Models & Data Sheet
Product Features Test Conditions Unit F4BTME298 F4BTME300 F4BTME320 F4BTME350
Dielectric Constant (Typical) 10GHz / 2.98 3.0 3.2 3.5
Dielectric Constant Tolerance / / ±0.06 ±0.06 ±0.06 ±0.07
Loss Tangent (Typical) 10GHz / 0.0018 0.0018 0.0020 0.0025
20GHz / 0.0023 0.0023 0.0026 0.0035
Dielectric Constant Temperature Coefficient -55 º~150ºC PPM/℃ -78 -75 -75 -60
Peel Strength 1 OZ F4BTM N/mm >1.6 >1.6 >1.6 >1.6
1 OZ F4BTME N/mm >1.4 >1.4 >1.4 >1.4
Volume Resistivity Standard Condition MΩ.cm ≥1×10^7 ≥1×10^7 ≥1×10^7 ≥1×10^7
Surface Resistivity Standard Condition MΩ ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >26 >30 >32 >32
Breakdown Voltage (XY direction) 5KW,500V/s KV >34 >35 >40 >40
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 15,16 15,16 13,15 10,12
Z direction -55 º~288ºC ppm/ºC 78 72 58 51
Thermal Stress 260℃, 10s,3 times No delamination No delamination No delamination No delamination
Water Absorption 20±2℃, 24 hours % ≤0.05 ≤0.05 ≤0.05 ≤0.05
Density Room Temperature g/cm3 2.25 2.25 2.20 2.20
Long-Term Operating Temperature High-Low Temperature Chamber ℃ -55～+260 -55～+260 -55～+260 -55～+260
Thermal Conductivity Z direction W/(M.K) 0.42 0.42 0.50 0.54
PIM Only applicable to F4BTME dBc ≤-160 ≤-160 ≤-160 ≤-160
Flammability / UL-94 V-0 V-0 V-0 V-0
Material Composition / / PTFE, Fiberglass Cloth, nano-ceramics
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil.

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F4BTME300 High Frequency PCB PTFE RF PCB Built on 3.0mm thick with Immersion Silver

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F4BTME300 High Frequency PCB PTFE RF PCB Built on 3.0mm thick with Immersion Silver

Shenzhen Bicheng Electronics Technology Co., Ltd

Site Member
9 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
High Frequency PCB, Rogers PCB Board, Taconic PCB Board
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Site Member
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