Unveiling the Power of Hybrid PCB: RO4003C and FR-4 6-Layer Circuit Board

In the dynamic landscape of high-frequency applications, the need for precision and reliability is paramount. Our Hybrid PCB, crafted with a strategic fusion of RO4003C and FR-4 materials in a 6-layer configuration, stands as a testament to innovation and excellence. Let's delve into the intricacies of this advanced circuit board through a detailed Q&A exploration:

Q: What distinguishes the RO4003C material in our Hybrid PCB?
A: The RO4003C material offers a unique blend of woven glass reinforced hydrocarbon/ceramics, combining the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. With tight control over dielectric constant (Dk) and low loss characteristics, RO4003C provides exceptional performance at a fraction of the cost of conventional microwave laminates.

Q: What are the key features of the RO4003C material utilized in our Hybrid PCB?
A: The RO4003C material boasts a dielectric constant of DK 3.38 +/-0.05 at 10GHz, a dissipation factor of 0.0027 at 10GHz, and a thermal conductivity of 0.71 W/m/°K. Additionally, it offers a high thermal resistance, low moisture absorption of 0.06%, and a thermal coefficient of dielectric constant suitable for a wide temperature range.

Q: How does the FR-4 S1000-2M material complement the RO4003C in the Hybrid PCB?
A: The FR-4 S1000-2M material in the Hybrid PCB brings additional benefits such as lower Z-axis coefficient of thermal expansion for improved through-hole reliability, excellent mechanical processability, lead-free compatibility, high heat resistance, and superior anti-CAF performance. This combination enhances the overall performance and reliability of the circuit board.

Q: Can you provide insights into the stackup and construction details of our 6-layer Hybrid PCB?
A: The 6-layer rigid PCB stackup comprises alternating layers of copper, RO4003C, FR-4, and prepreg bondply. With precise dimensions, copper weights, via plating thickness, surface finish, solder mask colors, and impedance control on key traces, the construction details are meticulously designed to meet high-frequency application requirements.

Q: What are some typical applications that benefit from our Hybrid PCB?
A: Our Hybrid PCB caters to a wide range of high-frequency applications, including commercial airline broadband antennas, microstrip and stripline circuits, millimeter wave applications, radar systems, guidance systems, and point-to-point digital radio antennas. Its versatility and reliability make it ideal for industries at the forefront of technological innovation.

Q: What quality standards does our Hybrid PCB adhere to, and is it available worldwide?
A: Our Hybrid PCB meets IPC-Class-2 quality standards, ensuring consistent performance and reliability. It is available worldwide, making it accessible to customers across the globe who seek advanced circuit boards for their high-frequency projects.

Embark on a journey of innovation and precision with our Hybrid PCB featuring the unmatched combination of RO4003C and FR-4 materials. Elevate your high-frequency applications to new heights of performance and reliability. Contact us today to explore the endless possibilities with our advanced circuit boards.