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Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors
Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors
Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors
Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors
Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors
Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors
Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors
Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors
Specifications
Brand Name :
HRT
Model Number :
A1501 wafer
Certification :
ISO9001/ ISO14001/UL/RoHS/REACH
Place of Origin :
China
MOQ :
5000 PCS
Price :
Negotiated
Payment Terms :
TT, Western Union, PayPal, L/C
Supply Ability :
1000 pcs per day
Delivery Time :
5 to 8 working days after payment checked
Packaging Details :
Carton / Paper pots
Product Name :
A1501WV / A1501WR
Pitch :
1.50mm
The Number of pin :
02PIN~15PIN
Material :
Pin: Brass/Tin-plated Wafer:PA6T
Row :
Single
Fire-protection rating :
UL 94V-0
Description

Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors

Description:

1.A1501 series Wafer have A1501WV A1501WR (Single row housing suitable A11501-T series terminal )

2, Wafer used materials:PA6T , Fire-protection rating is UL 94-V0. Minimum packing quantity is 1000pcs/bag.

3. Single row Wafer we have 02PIN~15PIN ,The daily production capacity is 30 to 50 KPCS.

4.Terminals are stamped by Phosphor Bronze, E-Stamping beforeTin-plated , Tin-plated we calling A1501-TPe , Minimum packing quantity is 20,000pcs/Reel. The daily production capacity is 300 to 400 KPCS.

5.Terminals' wire range :AWG #22--#28insulation OD is0.90mm(Max).

Test Description Procedure Requirement

Contact Resistance

 Mate connectors, measure by dry circuit, 20mV max., 10mA.(Based upon JIS C5402 5.4) 20mΩ (Max.)
Insulation Resistance Mate connectors, apply 500V DC between adjacent terminal or ground. (Based upon JIS C5402 5.2/MIL-STD-202 Method 302 Cond. B) 1000MΩ (Min.)
Dielectric Withstanding Voltage Mate connectors, apply 800V AC (rms) for 1 minute between adjacent terminal or ground. (Based upon JIS C5402 5.1/MIL-STD-202 Method 301)) No Breakdown.
Contact Resistance on Crimped Portion Crimp the applicable wire on to the terminal, measure by dry circuit, 20mV (Max.)., 10mA. 5mΩ (Max.)

Current rated
3A AC/DC maximum
Voltage rated 350V AC/DC
Withstand voltage 500V AC/minute
Insulation resistance 1000MΩ min
Contact resistance 20MΩ max
Operating temperature -25 - 85°C

Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors

Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors

Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectorsWafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors

Environmental Performance And Others

Test Description Procedure Requirement
6-1 Temperature Rise Carrying rated current load.(Based upon UL 498) 30℃(Max.)
6-2 Heat Resistance 85±2℃,96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A)

Appearance No Damage.

Contact Resistance 40mΩ (Max.)
6-3 Cold Resistance -25±3℃,96 hours (Based upon JIS C0020)
6-4 Humidity

Temperature: 40±2℃

Relative Humidity : 90~95%

Duration: 96 hours

(Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B)

Appearance No Damage.

Contact Resistance 40mΩ (Max.)

Insulation Resistance 100MΩ (Min.)

Dielectric Withstanding Voltage Must meet 4-3
6-5 Temperature Cycling

5 cycles of:

a) -55℃ 30 minutes

b) +85℃ 30 minutes

(Based upon JIS C0025)

Appearance No Damage.

Contact Resistance 40mΩ (Max.)
6-6 Salt Spray Tin-plated 12 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101C Cond. B)
6-7 SO2 Gas

24 hours exposure to 50±5ppm.

SO2 gas at 40±2℃.
6-8 NH3 Gas 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution.
6-9 Solderability

Soldering Time: 5±0.5 sec.

Solder Temperature: 245±5℃

 Solder Wetting 95% of immersed area must show no voids, pin holes
6-10 Resistance to Soldering Heat

Solder pot method

Soldering time: 10±0.5 sec.

Solder Temperature: 260±5℃

Solder iron method

Soldering Time: 5±0.5 sec.

Solder Temperature: 370℃ ~ 400℃

 Appearance No Damage.

Actuator Insertion/Withdrawal Force

[Unit : kgf]

Circuits At Initial
Insertion (Max.) Withdrawal (Min.)
Single 0.70 0.06
02 2.50 0.30
03 3.00 0.40
04 3.50 0.50
05 4.00 0.60
06 4.50 0.70
07 5.00 0.80
08 5.50 0.90
09 5.50 1.00
10 6.00 1.10
11 6.00 1.20
12 6.50 1.30
13 6.50 1.40
14 7.00 1.50
15 7.00 1.60

Product tags

1.25 mm pitch connectors

,

1.27 mm pitch connectors

,

fine pitch connector
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Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors

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Product Detail
Brand Name :
HRT
Model Number :
A1501 wafer
Certification :
ISO9001/ ISO14001/UL/RoHS/REACH
Place of Origin :
China
MOQ :
5000 PCS
Price :
Negotiated
Contact Supplier
Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors
Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors
Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors
Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors

RULETEAM CONNECTION TECHNOLOGY (SHENZHEN) CO.,LTD

Active Member
10 Years
guangdong, shenzhen
Since 2004
Business Type :
Manufacturer, Exporter
Main Products :
Circuit Board Wire Connectors, Wire To Board Connectors, Wire To Wire Connectors
Total Annual :
20,000,000-24,999,999
Employee Number :
100~149
Certification Level :
Active Member
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