MachineU > China Products > Machinery > Chemical & Pharmaceutical Machinery > Chemical Machinery & Equipment > Drying Equipment
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control
Specifications
Brand Name :
ASLI
Model Number :
RHD-45
Certification :
CE , ISO , SGS
Place of Origin :
China
MOQ :
1 set
Supply Ability :
negotiate
Delivery Time :
15 workdays
Packaging Details :
standard wooden case
Price :
Negotiate
Payment Terms :
T/T, Western Union
Internal Dimension :
W450×H400×D400mm
Temp. Control Accuracy :
+/-0.5℃
Heating Medium :
electric heating tube
Current Controller :
SSR
Max. Temperature :
500C
Control Method :
PID Control
Application :
IC Packaging
Power :
AC380V
Description
500C Hot Air High Temperature Drying Oven for IC Packaging with PID Control
Product Description

High Temperature Drying Oven can provide a stable test space for pre-heating, drying, changes about physics and chemistry testing. It supplys precision temperature controllter with high stability of platinum resistance to temperature that makes temperature well-distribution.

Name
High Temperature Oven
Model
RHD - 45
RHD - 60
RHD - 90
Internal Dimension W×H×D(mm )
450×400×400
500×600×500
600×900×500
External Dimension W×H×D(mm )
650×900×550
700×1200×650
850× 1600×700
Interior and Exterior Material
Interior material is SUS 304# stainless steel,
exterior is stainless steel or SEE cold-rolled steel with paint coated.
Temperature Range
(RT+15C) to 200C; (300 to 500℃ is optional)
Indication Resolution/ Distribution Uniformity
0.1℃/±2.0℃;( When temperature is 100℃)
Temperature Rising Velocity
Temperature rising velocity: from R.T. to 200℃,needs approx. 35mins

500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control

500C Hot Air High Temperature Drying Oven Specifications

1. Outside SECC steel, fine powder coating treatment; Inner SUS#304 stainless steel.
2. Use new high temperature resistant long shaft motor
3 Turbine fan.
4. Silicone forced tight.
5. Overtemperature protection, super load automatic power system.
6. Circulation system: air force level cycle.
7. Heating system:PID+S.S.R.
8. The thermostat: PID microcomputer control, automatic constant temperature, temperature quickly compensation function
9. Timer: temperature to time, when the power failure alarm indication.
10. According to customer demand matching glass window can be customized according to customer specifications specified.

Detailed Images
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control

If you need more information about 500C Hot Air High Temperature Drying Oven for IC Packaging with PID Control, please don't hesitate to contact us.

Product tags

smd reflow oven

,

sop for hot air oven

,

digital hot air oven
Send your message to this supplier
Send Now

500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control

Ask Latest Price
Watch Video
Product Detail
Brand Name :
ASLI
Model Number :
RHD-45
Certification :
CE , ISO , SGS
Place of Origin :
China
MOQ :
1 set
Supply Ability :
negotiate
Contact Supplier
video
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control

ASLi (CHINA) TEST EQUIPMENT CO., LTD

Active Member
10 Years
Since 1988
Business Type :
Manufacturer
Main Products :
Temperature Humidity Chamber, Walk In Stability Chamber, Thermal Shock Chamber
Total Annual :
10000000-12000000
Employee Number :
100~120
Certification Level :
Active Member
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products High Temperature Ovens
MachineU China Products Machinery Chemical & Pharmaceutical Machinery Chemical Machinery & Equipment Drying Equipment
Contact Supplier
Submit Requirement