9um 12um 18um 35um High Density FPC PCB Copper Foil
Specification:
Thickness: 9µm~35µm
Performances:
The product surface is black or red, has lower surface roughness.
Applications:
Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.
Features:
High density, high bending resistance and good etching performance.
Microstructure:
Table1- Performance:
Classification | Unit | 9μm | 12μm | 18μm | 35μm | |
Cu Content | % | ≥99.8 | ||||
Area Weigth | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | |
Tensile Strength | R.T.(23℃) | Kg/mm2 | ≥28 | |||
H.T.(180℃) | ≥15 | ≥15 | ≥15 | ≥18 | ||
Elongation | R.T.(23℃) | % | ≥5.0 | ≥5.0 | ≥6.0 | ≥10 |
H.T.(180℃) | ≥6.0 | ≥6.0 | ≥8.0 | ≥8.0 | ||
Roughness | Shiny(Ra) | μm | ≤0.43 | |||
Matte(Rz) | ≤2.5 | |||||
Peel Strength | R.T.(23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.8 | ≥0.8 |
Degraded rate of HCΦ(18%-1hr/25℃) | % | ≤7.0 | ||||
Change of color(E-1.0hr/200℃) | % | Good | ||||
Solder Floating 290℃ | Sec. | ≥20 | ||||
Appearance(Spot and copper powder) | ---- | None | ||||
Pinhole | EA | Zero | ||||
Size Tolerance | Width | mm | 0~2mm | |||
Length | mm | ---- | ||||
Core | Mm/inch | Inside Diameter 79mm/3 inch |
Why Choose us Civen as your supplier?
1. Very competitive price
2. Small order acceptable
3. Good quality
4. On time delivery and perfect service
5. Customers' design are welcome!