T2 Conductive High Temperature Copper Foil Sheet Roll
Product Profile :
We developed out there treated copper foil that has very low profile, this kind of copper foil is best for high frequency application.The surface treated copper foil, like 18um, 35um, 50um usually used in Multi-layer and double face FPCB construction, We also produce heavy ED copper foil, mainly for high current FPCB construction.
Mechanical Properties Sheet:
Quality Items | General Technical Terms | |||||
1/3oz | 1/2oz | 1oz | 2oz | 3oz | ||
Surface Roughness (µm) | Matte Surface Rz | ≤6 | ≤7 | ≤10 | ≤12 | ≤5.1 |
Peel Strength (kg/cm) | ≥1.1 | ≥1.2 | ≥1.8 | ≥2.2 | ≥1.0 | |
Leakage Points (points/m2) | ≤5 | No | ||||
High Temperature Anti-Oxidization Performance(180℃/h) | No Oxidization | |||||
Width Tolerance (mm) | Roll | (+2.0,0) | ||||
Piece | (+2.0,-2.0) | |||||
Test Standard | IPC-4562 |
Features:
The material has higher extensibility, and has a high bending resistance and no crack.
Performances:
Item | Unit | Parameters | |||||
12μm | 18μm | 25μm | 35μm | 70μm | |||
Mass per unit(±5%) | g/m² | 105 | 160 | 300 | 400 | 445 | |
Cu+Ag | % | ≥99.99 | |||||
Temper |
| H | O,H | O,H | O,H | O,H | |
Surface roughness | Ra | μm | 0.13 | 0.12 | 0.1 | 0.08 | 0.08 |
Rz | μm | 1.3 | 1.0 | 0.8 | 0.74 | 0.76 | |
Tensile strength | Normal Temp /23℃ | N/mm² | ≥430 | ≥450 | ≥450 | ≥450 | ≥450 |
High Temp /220℃ | N/mm² | ≥140 | ≥150 | ≥170 | ≥210 | ≥220 | |
Elongation | Normal Temp /23℃ | % | ≥1.5 | ≥3.0 | ≥4.0 | ≥4.2 | ≥4.5 |
High Temp /220℃ | % | ≥8 | ≥10 | ≥18 | ≥28 | ≥30 | |
Fatigue Resistance (annealed) | % | 65 | 65 | 65 | 65 | 65 | |
Maximum resistivity | Ωmm2/m | 0.0181 | |||||
Electrical conductivity | % | ≥98.3% | |||||
Film and adhesive layers | Instant Temp. 300℃/10s | Film and adhesive paste after transient temperature without blistering delamination. | |||||
Anti oxidation | H.T.(200℃) | Minute | Won’t Change the Color within 60 minutes | ||||
Pinhole test results | piece/ m² | Pinhole area more than 0.5 mm²,0.005 piece/ m² |