Semi automatic Ultrafast Laser Machine Ultraviolet Green Laser Cutting Machine
Function Introduction
Inorder to satisfy the high precision manufacturing requirements of various thin-plate materials, applied in consumer electronics industry PCB/FPC, cover layer profile, camera module, and fingerprint packaging chip, the machine adopts multiparameter real-time monitoring system and adaptive closed-loop control technique, such as terminal facula, beam aiming, and laser power. In this way, this machine is capable of providing solutions of simple, fast, non-consumable, contactless, high-accuracy, and arbitrarily shaped lineation, half dicing, cutting, and ablation.
Main Specification
Model
|
MU-450/500 |
Processing wide | 400mmx550mm/650mmx500mm |
Platform positioning accuracy | ≤±3μm |
The identification accuracy | 4μm/1μm |
Platform velocity | 1000mm/s |
Optimum cutting thickness | 1mm/2mm |
Features
1 Equipped with high-performance and high accuracy scanning mirror, and high accuracy linear motor working platform;
2 CCD automatic positioning, and automatic correction software;
3 Real time feedback in software interface;
4 High-efficiency dust proofing to effectively reduce the cleaning and maintenance time of equipment.