Equipment composition and introduction:
This machine is composed of automatic butyl tape system, butyl tape automatic tape strapping system, chip automatic transmission and positioning system, and control system. The glue machine head is placed on the mobile mechanism, and the rotation of the head is driven by the movement of the servo motor control timing belt to achieve rolling laying.
Device parameters:
1. Equipment dimensions: 1840*910*1800 (suitable for 600*1200 substrate);
2600*1815*1915(suitable for 1000*2000 substrate);
2. Running speed: 50~200mm/s adjustable (touch screen digital adjustable);
3. Conductive film disc replacement time: <2min;
4. The life of the sealing tape cutter is greater than 150,000 times;
5. Adhesive pressure 60~120N adjustable;
6. The tension of the feeding plate and the recycling plate can be digitally adjusted on the touch screen;
7. The width of the sealing tape is 12.7mm, and the thickness is 0.74mm
8. Machine efficiency: ≤52S