PCB Laser Depaneling Separator 0.02 Precision 335mm
Features:
Specification | |
Cutting accuracy of the whole machine: 0.03mm | humidity: <60% |
size of processed products: 330*330mm/330*670 | floor loading: 1500kgf/m2 |
moving speed of the platform:300mm/s | human-computer operation and data storage:industrial computer |
processing speed of the vibration mirror: ≤50000mm/s | size of the host computer: 1250*1300*1600 (L X H X D)mm |
minimum processing line width : 0.002mm | Machine Weight: 1500 Kg |
positioning accuracy of the platform: 0.003mm | Equipment Source: AC220/3KW |
operation interface: Chinese/English interface | operating system: Windows7 |
repeatability of the platform: 0.003mm | processing picture file: Gerber或DXF |
size of the dust collector: 500*650*900 (L X H X D)mm | compensation for shrinkage and expansion: Automatic compensation of MARK points |
ambient temperature: 20±2℃ | dust collector: 1.5KW |
power supply of the dust collector: AC 220V 50/60Hz | dust collector weight: 85Kg |
Our Service:
Coorporative Clients:
More information welcome to contact us:
Email: sales@dgwill.com
Wechat/Skype:+86 18166146357
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