Specifications
MOQ :
1PC
Price :
Negotiable
Payment Terms :
T/T
Supply Ability :
20000 pcs per month capacity
Delivery Time :
10-14 days delivery time
Packaging Details :
Box
Place of Origin :
China
Certification :
High QC standard, 100% inspection
Bonding Agent :
Resin
Common Shape :
1A1
Type: :
Cutting Tool
Feature :
High efficiency
Key word :
Centerless Wheels
Grit size :
Resin bond the finest grit size is 3000
Description
Centerless Wheels​​

Centerless grinding is a machining process that uses abrasive cutting to remove material from a workpiece. Centerless grinding differs from centered grinding operations in that no spindle or fixture is used to locate and secure the workpiece; the workpiece is secured between two rotary grinding wheels, and the speed of their rotation relative to each other determines the rate at which material is removed from the workpiece.

Features:

Resin:
High efficiency grinding in one batch, good sharpness, long using life
Vitrified:
high efficiency and good shape retention

Specification:

Common Shape Wheel Size Grit Size Classic Specification
1A1 Resin
Maximum OD is 750mm
Vitrified
OD:300mm~500mm
Resin
the finest grit size is 3000
 

Application

Industry Workpiece&Material Machine Bond Working Data
Semiconductor and Photovoltaic industries Ceramic, magnet, sapphire   Resin
Vitrified
 
Send your message to this supplier
Send Now

Centerless Grinding Wheel For Semiconductor And Photoelectricity Industries

Ask Latest Price
MOQ :
1PC
Price :
Negotiable
Payment Terms :
T/T
Supply Ability :
20000 pcs per month capacity
Delivery Time :
10-14 days delivery time
Packaging Details :
Box
Contact Supplier
Centerless Grinding Wheel For Semiconductor And Photoelectricity Industries

Xinzheng Dia Abrasives Co.,Ltd

Active Member
6 Years
Business Type :
Manufacturer, Exporter
Certification Level :
Active Member
Contact Supplier
Submit Requirement