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Gang Cutting Blades​ Grinding Wheel For Semiconductor And Photoelectricity
Gang Cutting Blades​ Grinding Wheel For Semiconductor And Photoelectricity
Specifications
MOQ :
1PC
Price :
Negotiable
Payment Terms :
T/T
Supply Ability :
20000 pcs per month capacity
Delivery Time :
10-14 days delivery time
Packaging Details :
Box
Place of Origin :
China
Certification :
High QC standard, 100% inspection
Common Shape :
1A1R
Bond :
Resin Metal
Application :
Semiconductor industry, Optical glass, Quartz, Magnetic material, Steel, Ceramic
Feature :
High Precision
Key word :
Gang Cutting Blades
Grit size :
#80-#3000
Description
High Precision Gang Cutting Blades​

Multiple pieces of cutting blades are used together, it requires all every piece with high dimension tolerance and flatness.

Specification:

Specifications: Application
Common Shape Wheel Size Grit Size Classic Specification Industry Workpiece&Material Machine Bond Working Data
1A1R OD: 50-400mm #80-#3000 　 Semiconductor industry, Optical glass, Quartz, Magnetic material, Steel, Ceramic Silicon, stone 　 Resin
Metal		 　

Features:

1. High precision cutting
2. High effciency cutting
3. High uniformity cutting


Product tags

grinding wheel for semiconductor and photoelectricity

,

grinding wheel for cutting tools industry

,

cutting grinding wheels
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Gang Cutting Blades​ Grinding Wheel For Semiconductor And Photoelectricity

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Product Detail
MOQ :
1PC
Price :
Negotiable
Payment Terms :
T/T
Supply Ability :
20000 pcs per month capacity
Delivery Time :
10-14 days delivery time
Packaging Details :
Box
Contact Supplier
Gang Cutting Blades​ Grinding Wheel For Semiconductor And Photoelectricity

Xinzheng Dia Abrasives Co.,Ltd

Active Member
6 Years
Business Type :
Manufacturer, Exporter
Main Products :
Diamond Grinding Wheel, CBN Grinding Wheel, Gemstone Grinding Wheel
Certification Level :
Active Member
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