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Grinding Wheel For Semiconductor And Photoelectricity
Grinding Wheel For Semiconductor And Photoelectricity
Specifications
MOQ :
1PC
Price :
Negotiable
Payment Terms :
T/T
Supply Ability :
20000 pcs per month capacity
Delivery Time :
10-14 days delivery time
Packaging Details :
Box
Place of Origin :
China
Certification :
High QC standard, 100% inspection
Key word :
Centerless Grinding Wheel
Feature :
High efficiency grinding
Common Shape :
1A1
Wheel Size :
Resin Maximum OD is 750mm Vitrified OD:300mm~500mm
Application :
Semiconductor and Photovoltaic industries
Grit size :
Resin bond the finest grit size is 3000
Description
Resin Vitrified Bond Centerless Grinding Wheel Good Sharpness With High Performance​​​

Centerless Grinding Wheels are made of grains of aluminum oxide and silicon carbide abrasive material, bonded together with vitrified, resin or rubber. Centerless Grinding Wheels are used on a wide variety of workpieces. They produce extremely close tolerances on metal cylindrical forms or parts.

Centreless grinding wheel is used for grinding cylindrical part out surface, supported without centres on a stationary work rest blade and moving between the grinding wheel and the regulating wheel.

Features:

Resin:
High efficiency grinding in one batch, good sharpness, long using life
Vitrified:
high efficiency and good shape retention

Specification:

Common Shape Wheel Size Grit Size Classic Specification
1A1 Resin
Maximum OD is 750mm
Vitrified
OD:300mm~500mm		 Resin
the finest grit size is 3000		 　

Application

Industry Workpiece&Material Machine Bond Working Data
Semiconductor and Photovoltaic industries Ceramic, magnet, sapphire 　 Resin
Vitrified		 　

For any inquire, quality feedback or technical question, there always be a professional responding answered by our technician team within 24 hours.

Product tags

grinding wheel for semiconductor and photoelectricity

,

green grinding wheel for carbide

,

grinding wheel for ss material
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Grinding Wheel For Semiconductor And Photoelectricity

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Product Detail
MOQ :
1PC
Price :
Negotiable
Payment Terms :
T/T
Supply Ability :
20000 pcs per month capacity
Delivery Time :
10-14 days delivery time
Packaging Details :
Box
Contact Supplier
Grinding Wheel For Semiconductor And Photoelectricity

Xinzheng Dia Abrasives Co.,Ltd

Active Member
6 Years
Business Type :
Manufacturer, Exporter
Main Products :
Diamond Grinding Wheel, CBN Grinding Wheel, Gemstone Grinding Wheel
Certification Level :
Active Member
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