Specifications
MOQ :
1PC
Price :
Negotiable
Payment Terms :
T/T
Supply Ability :
20000 pcs per month capacity
Delivery Time :
15-20 days delivery time
Packaging Details :
Box
Place of Origin :
China
Certification :
High QC standard, 100% inspection
Common Shape :
6A2, 6A2T
Bond :
Vitrified
Application :
Semiconductor industry
Key word :
Back Thinning Wheels​
Grit size :
Coarse Grit: 270--800 Finish Grit: 2000--8000
Feature :
High efficiency
Description
Vitrified & Metal Bond Back Thinning Wheels​

The back thinning is performed by a wet grind process with a rust inhibitor for cooling the chips and keeping the grind wheel free of debris. The grinding wheel acts a very important role in the grinding process, a low quality grinding wheel will lead high reject rate.

Features:

  1. ​Good surface quality
  2. High efficiency
  3. No scratch
  4. No chipping
  5. Long using life

Specification:

Specifications: Application
Common Shape Wheel Size Grit Size Classic Specification Industry Workpiece&Material Machine Bond Working Data
6A2, 6A2T, 1A1 OD: 175,195,209,305,255,355 Coarse Grit: 270--800
Finish Grit: 2000--8000
6A2 175D 30T 76H
6A2 200D 35T 76H
6A2T 280D 30T 228.6H
1A1 40D 5T 18.7H
Semiconductor industry Sapphire, silicon wafer SHUWA, NTS, WEC, GALAXY. SPEEDFAM
DISCO, OKAMOTOI, TSK, G&N, STRASBAUGH, LAMPMASTER
Vitrified
Metal
 
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Vitrified Dond Diamond Grinding Wheels With No Scratch And Chipping

Ask Latest Price
MOQ :
1PC
Price :
Negotiable
Payment Terms :
T/T
Supply Ability :
20000 pcs per month capacity
Delivery Time :
15-20 days delivery time
Packaging Details :
Box
Contact Supplier
Vitrified Dond Diamond Grinding Wheels With No Scratch And Chipping

Xinzheng Dia Abrasives Co.,Ltd

Active Member
6 Years
Business Type :
Manufacturer, Exporter
Certification Level :
Active Member
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