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3A1 3A1R Grinding Wheel For Semiconductor And Photoelectricity Industry
3A1 3A1R Grinding Wheel For Semiconductor And Photoelectricity Industry
Specifications
MOQ :
1PC
Price :
Negotiable
Payment Terms :
T/T
Supply Ability :
20000 pcs per month capacity
Delivery Time :
15-20 days delivery time
Packaging Details :
Box
Place of Origin :
China
Certification :
High QC standard, 100% inspection
Common Shape :
3A1, 3A1R
Wheel Size :
OD:10-200 T:0.07-2.0 H:6, 8, 12.7, 31.75,50.8"
Advantage: :
high precision
Application :
Semiconductor & Photoelectricity
Bond :
Resin Metal
Grit size :
3um-70um
Description
Metal & Resin Bond Dicing Blade

Ultra thin dicing blades are widely used in semiconducto industry

Features:

  • Metal bond can hold grit size strongly
  • high precision
  • good shape holding
  • good wear resistant and long using life

Specification:

Specifications: Application
Common Shape Wheel Size Grit Size Classic Specification Industry Workpiece&Material Machine Bond Working Data
1A8, 1A1R OD:10-200
T:0.07-2.0
H:6, 8, 12.7, 31.75,50.8		 3um-70um 　 semiconductor industry
optical glass industry
optical communication		 BGA, LGA, LED
Blue glass, crystal, gem, filter
quartz		 　 Resin
Metal		 　

3A1 3A1R Grinding Wheel For Semiconductor And Photoelectricity Industry

Product tags

grinding wheel for semiconductor and photoelectricity

,

grinding wheel for tungsten carbide

,

tungsten carbide grinding wheel
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3A1 3A1R Grinding Wheel For Semiconductor And Photoelectricity Industry

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Product Detail
MOQ :
1PC
Price :
Negotiable
Payment Terms :
T/T
Supply Ability :
20000 pcs per month capacity
Delivery Time :
15-20 days delivery time
Packaging Details :
Box
Contact Supplier
3A1 3A1R Grinding Wheel For Semiconductor And Photoelectricity Industry

Xinzheng Dia Abrasives Co.,Ltd

Active Member
6 Years
Business Type :
Manufacturer, Exporter
Main Products :
Diamond Grinding Wheel, CBN Grinding Wheel, Gemstone Grinding Wheel
Certification Level :
Active Member
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