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Metal & Resin Bond Dicing Saw Blade , High Precision Diamond Dicing Blades
Metal & Resin Bond Dicing Saw Blade , High Precision Diamond Dicing Blades
Specifications
MOQ :
1PC
Price :
Negotiable
Payment Terms :
T/T
Supply Ability :
20000 pcs per month capacity
Delivery Time :
15-20 days delivery time
Packaging Details :
Box
Place of Origin :
China
Certification :
High QC standard, 100% inspection
Common Shape :
1A8, 1A8S
Wheel Size :
OD:10-200 T:0.07-2.0 H:6, 8, 12.7, 31.75,50.8
Application :
Semiconductor & Photoelectricity
Bond :
Resin, Metal
Advantage: :
high precision
Grit size :
3um-70um
Description
Metal & Resin Bond Dicing Blade

Ultra thin dicing blades are widely used in semiconducto industry

Features:

  • Metal bond can hold grit size strongly
  • high precision
  • good shape holding
  • good wear resistant and long using life

Specification:

Specifications: Application
Common Shape Wheel Size Grit Size Classic Specification Industry Workpiece&Material Machine Bond Working Data
1A8, 1A1R OD:10-200
T:0.07-2.0
H:6, 8, 12.7, 31.75,50.8		 3um-70um 　 semiconductor industry
optical glass industry
optical communication		 BGA, LGA, LED
Blue glass, crystal, gem, filter
quartz		 　 Resin
Metal		 　

Metal & Resin Bond Dicing Saw Blade , High Precision Diamond Dicing Blades

Product tags

diamond sintered segments saw blades

,

sintered diamond saw blades

,

sintered segmented diamond saw blade
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Metal & Resin Bond Dicing Saw Blade , High Precision Diamond Dicing Blades

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Product Detail
MOQ :
1PC
Price :
Negotiable
Payment Terms :
T/T
Supply Ability :
20000 pcs per month capacity
Delivery Time :
15-20 days delivery time
Packaging Details :
Box
Contact Supplier
Metal & Resin Bond Dicing Saw Blade , High Precision Diamond Dicing Blades

Xinzheng Dia Abrasives Co.,Ltd

Active Member
6 Years
Business Type :
Manufacturer, Exporter
Main Products :
Diamond Grinding Wheel, CBN Grinding Wheel, Gemstone Grinding Wheel
Certification Level :
Active Member
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