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Custom Size Diamond Grinding Wheels Stable Performance 6A2T Monocrystalline Silicon
Custom Size Diamond Grinding Wheels Stable Performance 6A2T Monocrystalline Silicon
Custom Size Diamond Grinding Wheels Stable Performance 6A2T Monocrystalline Silicon
Custom Size Diamond Grinding Wheels Stable Performance 6A2T Monocrystalline Silicon
Custom Size Diamond Grinding Wheels Stable Performance 6A2T Monocrystalline Silicon
Custom Size Diamond Grinding Wheels Stable Performance 6A2T Monocrystalline Silicon
Custom Size Diamond Grinding Wheels Stable Performance 6A2T Monocrystalline Silicon
Custom Size Diamond Grinding Wheels Stable Performance 6A2T Monocrystalline Silicon
Specifications
Brand Name :
HT
Model Number :
HT-BGW
Certification :
ISO9001:2015
Place of Origin :
China
MOQ :
2
Price :
Price can be negotiated
Payment Terms :
T/C,T/T
Supply Ability :
300/pcs per month
Delivery Time :
2-3weeks
Packaging Details :
Carton Box
Name :
Silicon wafer back Grinding Wheels
Applications :
Sapphire epitaxial wafer,silicon wafer,gallium arsenide and GaN wafer
Space code :
6A2 or 6A2H;6A2T
Size :
Customer requirements
Using :
Semiconductor silicon
Body :
LED substrate
Description

Hongtuo, as a major designer, manufacturer and distributor of diamond and CBN grinding wheels, can offer an excellent selection of back grinding wheels. This particular grinding tool comes in two types: a silicon wafer back grinding wheel and an LED substrate back grinding wheel. Both of them can be used on different grinding machines made in Europe,America,Japan, and China. They also feature a stable performance and a high cost effectiveness.

1. Silicon Wafer Back Grinding Wheel

This abrasive wheel is primarily used for thinning and finishing semiconductor wafers. It comes with a superior grinding performance and a low coast. It can be used on grinding machines manufactured in Japan,Germany and China.

Grinding Objects: Discrete devices, IC substrate silicon wafers and original silicon wafers

Work Piece Materials: Monocrystalline silicon and other semiconductor materials

Processes: Back to front rough and fine grinding

2. LED Substrate Back Grinding Wheels

This variety of cup grinding wheel is mainly used in the LED industry for back grinding of sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers. It works well with European, American, Japanese and Chinese grinding machines with an excellent performance and cost effectiveness.

Grinding Objects: Sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers

Work Piece Materials: Synthetic sapphire, monocrystalline silicon, gallium arsenide and gallium nitride

Product tags

silicon carbide stone grinding wheels

,

industrial diamond grinding wheels

,

diamond edge grinding wheels
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Custom Size Diamond Grinding Wheels Stable Performance 6A2T Monocrystalline Silicon

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Product Detail
Brand Name :
HT
Model Number :
HT-BGW
Certification :
ISO9001:2015
Place of Origin :
China
MOQ :
2
Price :
Price can be negotiated
Contact Supplier
Custom Size Diamond Grinding Wheels Stable Performance 6A2T Monocrystalline Silicon
Custom Size Diamond Grinding Wheels Stable Performance 6A2T Monocrystalline Silicon
Custom Size Diamond Grinding Wheels Stable Performance 6A2T Monocrystalline Silicon
Custom Size Diamond Grinding Wheels Stable Performance 6A2T Monocrystalline Silicon

Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

Active Member
8 Years
henan, zhengzhou
Since 1997
Business Type :
Manufacturer, Importer, Exporter, Seller
Main Products :
Diamond Honing Tool, Single Pass Honing Tools, Cylinder Honing Tool
Total Annual :
5000000-10000000
Employee Number :
400~500
Certification Level :
Active Member
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