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Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate
Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate
Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate
Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate
Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate
Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate
Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate
Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate
Specifications
Brand Name :
HT
Model Number :
HT-WSB
Certification :
ISO9001:2015&ISO16949
Place of Origin :
China
MOQ :
2
Price :
Price can be negotiated
Payment Terms :
T/C,T/T
Supply Ability :
500/pcs per month
Delivery Time :
2-3weeks
Packaging Details :
Carton Box
Type :
Saw Blade
Finishing :
Nitride
Size :
50-100mm
Eletroplated :
Nickel
Application :
Silicon. GasAs, Gap. LiTa03
Thickness :
0.015mm-0.1mm
Description

Saw blade with diamond plated

If you’re searching for the right dicing blades, we recommend our HT-RE electroformed bond blades. They are a high performance and high quality wafer saw manufactured using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these super abrasive dicing blades and machining tools, please browse the other pages.

Features:

1. The ultra-thin design allows the circular blade to be used for deep cutting and slotting.

2. The blade thickness ranges from 0.015mm to 0.3mm.

3. Thanks to a combination of multiple specifications of diamond particles and various bonds, these electroformed dicing blades can be used for cutting and slotting compound semiconductors, silicon wafers and ceramic wafers.

Applicable Materials:

Silicon wafer, compound wafer with gallium arsenide, gallium phosphide, ceramics, lithium niobate, lithium tantalite and more.

Specifications:

**NOTE: The contents in the above picture provide relevant specifications for the electroformed bond blades. During the purchasing, please tell us all related factors so we can communicate and find the right product for you.

Technical Parameters of Electroformed Bond Blades

O.D Thickness I.D
Size Tolerance Size Standard tolerance High precision tolerance Size Tolerance
50～ 100 +0.02 0.1~≤ 0.15 ±0.005 25.4
30
31.75
40
60
80
88.9		 +0.02~ 0
0.15~≤ 0.25 ±0.005 ±0.003
>0.25 ±0.01 ±0.005

Product tags

diamond rockwell hardness

,

tungsten carbide sharpening stone

,

tungsten sharpener
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Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate

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Product Detail
Brand Name :
HT
Model Number :
HT-WSB
Certification :
ISO9001:2015&ISO16949
Place of Origin :
China
MOQ :
2
Price :
Price can be negotiated
Contact Supplier
Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate
Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate
Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate
Diamond Wafer Saw Blade Ultra - Thin With Gallium Arsenide Lithium Niobate

Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

Active Member
8 Years
henan, zhengzhou
Since 1997
Business Type :
Manufacturer, Importer, Exporter, Seller
Main Products :
Diamond Honing Tool, Single Pass Honing Tools, Cylinder Honing Tool
Total Annual :
5000000-10000000
Employee Number :
400~500
Certification Level :
Active Member
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