Resin bond daimond dicing Blade for wafer semicoductor,ceramic chips
Hongtuo’s HT-RB series resin bond diamond blades are some of the most advanced in diamond grinding technology. They apply a thermosetting resin bond material and inter it with diamond abrasives. This diamond grinding tool features an outstanding flexibility and can greatly improve cutting efficiency.It has become a preferred super abrasive tool for cutting hard, brittle and delicate materials, such as glass and crystalline materials.
Features:
1. Theresin bond diamond dicing blade comes with a great self-sharpening performance, which ensures a consistent sharpness and a high cutting efficiency.
2. Resin bonds are extremely flexible, therefore improving the surface finish quality.
Applications:
This dicing blade is best suited for cutting hard and brittle materials such as quartz and glass.
Specifications
Technical Parameters
O.D | Thickness | I.D | ||||
Size | Tolerance | Size | Standard tolerance | High precision tolerance | Size | Tolerance |
50~ 100 | +0.02 | 0.1~≤ 0.15 | ±0.005 | 25.4 30 31.75 40 60 80 88.9 |
+0.02~ 0 |