Specifications
Brand Name :
Hongtuo
Model Number :
HT-RB
Certification :
ISO9001:2015&ISO16949
Place of Origin :
China
MOQ :
2
Price :
Price can be negotiated
Payment Terms :
T/C,T/T
Supply Ability :
300/pcs per month
Delivery Time :
2-3weeks
Packaging Details :
Carton Box
Type :
Machine Blade
Blade Material :
Diamond
Finishing :
Other
Size :
58
Application :
Semicoductor,Ceramic chips
Thickness :
0.25MM
Bond :
Resin
Description

Resin bond daimond dicing Blade for wafer semicoductor,ceramic chips

Hongtuo’s HT-RB series resin bond diamond blades are some of the most advanced in diamond grinding technology. They apply a thermosetting resin bond material and inter it with diamond abrasives. This diamond grinding tool features an outstanding flexibility and can greatly improve cutting efficiency.It has become a preferred super abrasive tool for cutting hard, brittle and delicate materials, such as glass and crystalline materials.

Features:

1. Theresin bond diamond dicing blade comes with a great self-sharpening performance, which ensures a consistent sharpness and a high cutting efficiency.

2. Resin bonds are extremely flexible, therefore improving the surface finish quality.

Applications:

This dicing blade is best suited for cutting hard and brittle materials such as quartz and glass.

Specifications

Technical Parameters

O.D Thickness I.D
Size Tolerance Size Standard tolerance High precision tolerance Size Tolerance
50~ 100 +0.02 0.1~≤ 0.15 ±0.005 25.4
30
31.75
40
60
80
88.9
+0.02~ 0

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Resin Bond Daimond Dicing Blade , Wafer Semicoductor Disco Dicing Blades

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Brand Name :
Hongtuo
Model Number :
HT-RB
Certification :
ISO9001:2015&ISO16949
Place of Origin :
China
MOQ :
2
Price :
Price can be negotiated
Contact Supplier
Resin Bond Daimond Dicing Blade , Wafer Semicoductor Disco Dicing Blades

Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

Active Member
8 Years
henan, zhengzhou
Since 1997
Business Type :
Manufacturer, Importer, Exporter, Seller
Total Annual :
5000000-10000000
Employee Number :
400~500
Certification Level :
Active Member
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