Ultra-Thin Resin Bonded Diamond Cutting Blade,

Resin Bonded Diamond Dicing Blade Type: RTR1A8-003

To abrasive or cut Semiconductor,Optical Glass, Ceramics, Magnetic Material etc. etc

Sample specification: 58*40*0.32 mm ( D * H * T )

Diamond wheel shape and indicates:

D -- Out Diameter

H -- Inner Diameter

T -- Thickness

• Above form only a range of the data, we can make blades entirely as per client's requirement.

Main Features of Metal Sintered Dicing Blades :

• Customized products, Variety specification availabe as per client's size;

• High precision cutting;

• Minimized blade wear;

• Good stability;

• Long life using;

• Sharp and Durable.

Application of our Ultra-thin blades:

• Suitable for semiocnductor component(QFN,PQFN) to avoid burrs, and improve efficiency and life.
• Suitable for optical glass to avoid chip and improve yield;
• Suitable for quartz glass to avoid chips and improve effiency, and finish of product;
• Suitable for ceramics to avoid chips and cracks, and improve the processing quality.
• Suitable for slottingand cutting of crystal, magnetic materials, carbide and some other difficult to cut metal materials with excellent cutting quality.

More Pictrures of our blades:

Our Order Operating Procedure:

Over 15 years of developing and producing experience in high precision super hard material tools, we have

established a high efficiency system to provide stable performance wheel products.

We welcome yr free inquiry for any question in our diamond cutting wheels. In order to supply exact wheel

type and quotatioon to you, if possible, better for you to provide us more information like followings:

1. Yr processing objects.

2. Yr OD, ID, Thickness data.

3. Grit size if possible.

4. Rotary speed of your processing machine.

Many Thanks.