ultrasonic weapons cleaning tank 40khz/80khz/100khz high frequency

Cavitation threshold of the ultrasonic cleaner is closely related to ultrasonic frequency. The higher the frequency is, the higher the cavitation threshold is. In other words, the higher the frequency is, the greater the sound intensity or sound power required to produce cavitation in the liquid is; the lower the frequency is, the cavitation is easy to produce, and at the same time, the compression and thinning of the liquid have a longer time interval under the low frequency.
The bubble can grow to a larger size before collapse, and increase the cavitation intensity, which is conducive to cleaning. At present, the working frequency of the ultrasonic cleaner is roughly divided into three frequency bands according to the cleaning object; low frequency ultrasonic cleaning (20-50khz), high frequency ultrasonic cleaning (50-200khz) and megahertz ultrasonic cleaning (700khz-1mhz and above). The low-frequency ultrasonic cleaner is suitable for the occasion with high bonding strength on the surface of large parts or dirt and cleaning parts. Low frequency, high cavitation intensity.
It is not suitable to clean the parts with high surface finish, and the cavitation noise is large. When the frequency of ultrasonic cleaner is about 40KHz, under the same sound intensity, the number of cavitation bubbles is more than that when the frequency is 20kHz, and the penetration is stronger. It is better to clean the workpiece with complex surface shape or blind hole, and the cavitation noise is smaller. However, the cavitation strength is low, which is suitable for the occasion where the binding force between the dirt and the surface of the cleaned parts is weak. High frequency ultrasonic cleaning is suitable for the computer.
Fine cleaning of microelectronic components, such as disk, driver, reading and writing head, liquid crystal glass and flat panel display, micro components and polished metal parts. These cleaning objects are required to be free from cavitation corrosion during cleaning. It should be able to wash away micron level dirt. Megahertz ultrasonic cleaner is suitable for cleaning IC chips, silicon chips and thin films. It can remove the dirt of micron and submicron without any damage to the cleaning parts.
Because there is no cavitation at this time. The main cleaning mechanism of ultrasonic cleaner is the sound pressure gradient. Particle velocity and sound flow. The cleaning direction is strong, and the cleaned parts are generally placed in the direction parallel to the sound beam.

ultrasonic weapons cleaning tank 40khz/80khz/100khz high frequency