ultrasonic cleaner plastic tank equipment 28khz/40khz/3000Watt
Electronic operation is the earliest and most extensive operation of ultrasonic cleaner. Cleaning of electronic parts: electronic parts, such as semiconductor tube shell, IC shell, crystal shell, relay shell, electronic tube, etc. Substrate cleaning of electronic components of ultrasonic cleaner: the substrate of electronic components is made of semiconductor materials and packaged in metal or plastic housing. Before packaging, it is not only necessary to clean the housing, but also necessary to clean the substrate, such as IC chip, resistance, crystal, semiconductor, original film circuit, etc.
Cleaning PCB with ultrasonic cleaner: in the electronic operation of our country, most companies are using PCB. The soldering flux used for PCB assembly welding is divided into three types: water soluble, rosin type and cleaning free type. The first two types are used more often. The ultrasonic cleaner is used more often. In principle, the cleaning free type should not be clean. However, most manufacturers in the world even choose cleaning free welding. Flux welded components still need cleaning.
In particular, if the high-density PCB and high-density IC are not cleaned or the ultrasonic cleaner is not used, dust will be absorbed between the high-density lines and the IC feet. Once the environmental humidity is high, the short circuit between the high-density lines and the feet will easily occur and defects will appear. Once the environment is monotonous, the short circuit defects will disappear by themselves, and such defects are not easy to find. So the electronic machine factories all over the world insist on ultrasonic cleaning PCB. In our country, the military electronic machine factory has begun to implement, and received the two-tier benefits of improving the reliability of goods and reducing the cost of after-sales service.
In the production of connectors, connectors, adapters and other devices, it is necessary to clean the ultrasonic cleaner before electroplating and assembly, otherwise the dust and oil adsorbed on these assembled parts will affect their conductive and insulation functions, especially for some messy multi-core connectors.
Cleaning of electronic data after processing and forming: electronic data such as chips, silicon chips, piezoelectric ceramic chips, etc. are goods supplied to component manufacturers. It is necessary to clean their products before they leave the factory, especially those who do oral business. Cleaning of their products has become a big problem. Cleaning of ultrasonic cleaners is the most useful way.
Type | Internal size L*W*H (mm) | Outsize mm L*W*H (mm) | Frequency (Khz) | Power | Heating | Total power(W) | voltage |
ARS-DQXJ-1006 | 280×210×210 | 320×250×350 | 20,28,33,40,80,130 | 300 | 1000 | 1300 | 220V |
ARS-DQXJ-1012 | 400×310×280 | 520×430×600 | 20,28,33,40,80,130 | 600 | 3000 | 3600 | 220V |
ARS-DQXJ-1018 | 490×360×320 | 610×480×675 | 20,28,33,40,80,130 | 900 | 3000 | 3900 | 220V |
ARS-DQXJ-1024 | 630×430×320 | 740×550×675 | 20,28,33,40,80,130 | 1200 | 4000 | 5200 | 220V |
ARS-DQXJ-1030 | 630×530×320 | 750×650×675 | 20,28,33,40,80,130 | 1500 | 4000 | 5500 | 220V |
ARS-DQXJ-1036 | 680×530×360 | 800×650×700 | 20,28,33,40,80,130 | 1800 | 5000 | 6800 | 220V |
ARS-DQXJ-1040 | 680×570×400 | 830×710×735 | 20,28,33,40,80,130 | 2000 | 5000 | 7000 | 220V |
ARS-DQXJ-1041 | 730×570×450 | 880×710×735 | 20,28,33,40,80,130 | 2400 | 6000 | 8400 | 220V |
ARS-DQXJ-1042 | 790×670×510 | 940×765×785 | 20,28,33,40,80,130 | 3000 | 6000 | 9000 | 380V |
ARS-DQXJ-1043 | 850×770×570 | 990×820×785 | 20,28,33,40,80,130 | 4000 | 7000 | 11000 | 380V |
ARS-DQXJ-1044 | 910×820×620 | 1050×880×840 | 20,28,33,40,80,130 | 5000 | 7000 | 12000 | 380V |
ARS-DQXJ-1045 | 960×870×680 | 1100×940×920 | 20,28,33,40,80,130 | 8000 | 8000 | 16000 | 380V |
ARS-DQXJ-1046 | 1100×930×730 | 1160×1000×980 | 20,28,33,40,80,130 | 10000 | 8000 | 18000 | 380V |
ultrasonic cleaner plastic tank equipment 28khz/40khz/3000Watt