2. Increase the relative width of circuit board wiring.
3.Increase the thickness of copper coating.
4.Increase gold sinking process.
5. Add power lamp indication. 6. Improve the rationality of circuit board wiring, and apply copper to power supply and signal on two sides.
7. Solder paste used for patch improvement.
8. Improved double sided colloid product on the back.
9. Improved PWM line overlength and plug encapsulation.
