Specifications
Category :
RF and Wireless RFI and EMI - Shielding and Absorbing Materials
Adhesive :
-
Product Status :
Active
Thickness - Overall :
-
Package :
Bulk
Series :
CHO-BOND® 360-20
Material :
Epoxy, 2 Part
Mfr :
Parker Chomerics
Shelf Life Start :
Date of Manufacture
Width :
-
Shape :
-
Length :
-
Shelf Life :
9 Months
Storage/Refrigeration Temperature :
77°F (25°C)
Operating Temperature :
-
Type :
EMI Conductive Adhesive
Base Product Number :
50-01
Description :
SILVER COPPER EMI EPOXY 1PT
Description
RF EMI EMI Conductive Adhesive CHO-BOND® 360-20 Epoxy, 2 Part X X
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50-01-0360-0020

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Category :
RF and Wireless RFI and EMI - Shielding and Absorbing Materials
Adhesive :
-
Product Status :
Active
Thickness - Overall :
-
Package :
Bulk
Series :
CHO-BOND® 360-20
Contact Supplier
50-01-0360-0020

Beijing Silk Road Enterprise Management Services Co.,LTD

Verified Supplier
2 Years
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Agent, Importer, Exporter, Trading Company
Employee Number :
600~800
Certification Level :
Verified Supplier
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