Printed Circuit Board Assembly For Household Appliances
Specification | Process capability |
Type | Single-sided, double-sided, multi-layer |
Materials | FR-4, CEM-1, CEM-3, high-frequency halogen-free, aluminum, iron base, copper base |
Finish Board Thickness | 0.2mm-6.0mm |
Copper substrate thickness | 18um,35um,70um,105um |
Surface | Hasl(LF), Electroless nickel gold, spray tin, chemical gold, carbon oil, gold finger, OSP, immersion tin, immersion silver, OSP(Entek) |
Maximum size | 600mm*700mm |
Solder Mask | Green, Black, Blue, White, Red, Yellow |
Board Warp | Single-Sided≤1.0% Double-Sided ≤0.70%plywood≤0.50% |
The minimum thickness & Tolerance | 0.2mm±0.08mm |
Minimum line width / line Gap & Tolerance | Spray tin plate:0.1mm±20%(4mil±20%) |
| Gold Plate:0.076±20%(3mil±20%) |
Copper from the Edge | 0.5mm(20mil) |
Hole margin line edge | 0.3mm(12mil) |
Minimum aperture & Tolerance | 0.2mm±0.076mm(16mil±3mil) |
Minimum Pitch & Tolerance | 0.4mm±0.076mm(16mil±3mil) |
Hole copper thickness | 20-25um(0.79mil-1.0mil) |
Positioning hole deviation | ±0.076mm(±3mil) |
Chong Min hole diameter | FR-4 Board Thickness 1.0mm (40mil) the following:1.0mm(40mil) |
| FR-4 Board Thickness 1.2-3.0mm(48-120mil):1.5mm(60mil) |
Min Chong Fang slot specifications | FR-4CEM-3 Board Thickness 1.0mm(40mil) :0.8mm*0.8mm(32mil*32mil) |
| FR-4 Board Thickness 1.2-3.0mm(48-120mil):1.0mm*1.0mm(40mil*40mil) |
Screen Printing Line bias | ±0.076(±3mil) |
Min pad window | 0.076mm(±3mil) |
Minimum green oil Bridge | ±0.76mm(±3mil) |