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RoHS High TG FR4 Contract 3mil SMT PCB Assembly
RoHS High TG FR4 Contract 3mil SMT PCB Assembly
RoHS High TG FR4 Contract 3mil SMT PCB Assembly
RoHS High TG FR4 Contract 3mil SMT PCB Assembly
RoHS High TG FR4 Contract 3mil SMT PCB Assembly
RoHS High TG FR4 Contract 3mil SMT PCB Assembly
Specifications
Brand Name :
OEM/ODM
Model Number :
SL00710S01
Certification :
UL, Rohs
Place of Origin :
China
MOQ :
Negotiable
Price :
Negotiable
Payment Terms :
L/C, T/T, Western Union, MoneyGram
Supply Ability :
5000 Piece/Pieces per Day
Delivery Time :
7-12 days
Packaging Details :
ESD Bag
Copper thickness :
1oz,1/2OZ 1OZ 2OZ 3OZ
Base material :
FR-4
Board thickness :
0.5~3.2mm
Min. line spacing :
4/4mil(0.1/0.1mm)
Min. line width :
0.075mm/0.075mm(3mil/3mil)
Min. hole size :
0.20mm,4mil
Surface finishing :
HASL,ENIG
Product name :
PCB Assembly
Application :
Consumer Electronics
Pcb assembly method :
SMT
Description

High TG FR4 Contract Manufacturing Engineering Fast SMT PCBA

This PCBA Board is assembled with FR - 4 made bare pcb board and the board thickness is 1.6 mm, copper thickness is normally 1OZ / 35 µm. Immersion gold surface treatment make the PCBa work longer and more eco-friendly. We need Gerber File & BOM List to produce your PCBa assembly order.


Files Requested For PCB Assembly Quotation


---In order to provide you with the most efficient and accurate quote on manufacturing the requested unit, we ask that you provide us with the following information.
1. Gerber file,PCB file,Eagle file or CAD file are all acceptable
2. A detailed bill of materials (BOM)
3. Clear pictures of PCB or PCBA sample for us
4. Quantity and delivery required
5. Test method for PCBA to guarantee 100% good quality products.
6. Schematics file for PCB design if need to do function test.
7. A sample if available for better sourcing
8. CAD files for enclosure manufacturing if required
9. A complete wiring and assembly drawing showing any special assembly instructions if required

Shinelink kinds PCBA product

RoHS High TG FR4 Contract 3mil SMT PCB Assembly



94V0 PCBA manufacture Scale capabilities up to

We combine advanced processes with highly skilled resources. Keeping up with the leading advanced technology and management system in One-stop services of PCB assembly

SMT process (RoHs Compliant) Capabilities up to:

1. 0201 Chip Size
2. 12 mils Integrated Circuit (IC) Pitch
3. Micro Ball Grid Array (BGA) – Pitch 16 mils
4. Flip Chip (Controlled Collapse Chip Connection) – Pitch 5 mils
5. Quad Flat Package (QFP) – Pitch 12 mils

THT(Wave soldering) process (RoHs Compliant) Capabilities up to:

1.Single side wave soldering

2.SMT & THT mixture process

RoHS High TG FR4 Contract 3mil SMT PCB Assembly


PCB Assembly Capabilities

Turnkey PCBA PCB+components sourcing+assembly+package
Assembly details SMT and Thru-hole, ISO lines
Lead Time Prototype: 15 work days. Mass order: 20~25 work days
Testing on products Flying Probe Test, X-ray Inspection, AOI Test, functional test
Quantity Min quantity: 1pcs. Prototype, small order, mass order, all OK
Files we need PCB: Gerber files(CAM, PCB, PCBDOC)
Components: Bill of Materials(BOM list)
Assembly: Pick-N-Place file
PCB panel Size Min size: 0.25*0.25 inches(6*6mm)
Max size: 20*20 inches(500*500mm)
PCB Solder Type Water Soluble Solder Paste, RoHS lead free
Components details Passive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine Pitch to 0.8mils
BGA Repair and Reball
Part Removal and Replacement
Component package Cut Tape,Tube,Reels,Loose Parts
PCB assembly
process		 Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing



PCBA Picture

RoHS High TG FR4 Contract 3mil SMT PCB Assembly

FAQ:

1. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

2. What’s the key equipments for HDI manufacturing?

Key equipment list is as following: Laser drilling machine, Pressing machine, VCP line, Automatic Exposing machine, LDI and etc.

The equipments we have are the best in the industry, laser drilling machines are from Mitsubishi and Hitachi, LDI machines are from Screen(Japan), Automatic Exposing machines are also from Hitachi, all of them make we can meet customer’s technical requirements.

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RoHS High TG FR4 Contract 3mil SMT PCB Assembly

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Product Detail
Brand Name :
OEM/ODM
Model Number :
SL00710S01
Certification :
UL, Rohs
Place of Origin :
China
MOQ :
Negotiable
Price :
Negotiable
Contact Supplier
RoHS High TG FR4 Contract 3mil SMT PCB Assembly
RoHS High TG FR4 Contract 3mil SMT PCB Assembly
RoHS High TG FR4 Contract 3mil SMT PCB Assembly

Shenzhen Shinelink Technology Ltd

Active Member
5 Years
guangdong, shenzhen
Since 2005
Business Type :
Manufacturer, Trading Company, Other
Main Products :
EMS PCB Assembly, SMT PCB Assembly, Turnkey PCB Assembly
Total Annual :
200-300
Employee Number :
93~105
Certification Level :
Active Member
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